Invention Grant
- Patent Title: Multi-orientation semiconductor-on-insulator (SOI) substrate, and method of fabricating same
- Patent Title (中): 多取向半导体绝缘体(SOI)基板及其制造方法
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Application No.: US11276366Application Date: 2006-02-27
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Publication No.: US07531392B2Publication Date: 2009-05-12
- Inventor: John J. Ellis-Monaghan , Mark D. Jaffe
- Applicant: John J. Ellis-Monaghan , Mark D. Jaffe
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Scully, Scott, Murphy & Presser, P.C.
- Agent Riyon Harding
- Main IPC: H01L21/84
- IPC: H01L21/84

Abstract:
The present invention relates to semiconductor-on-insulator (SOI) substrate structures that contain surface semiconductor regions of different crystal orientations located directly on an insulator layer. The present invention also relates to methods for fabricating such SOI substrate structures, by growing an insulator layer directly on a multi-orientation bulk semiconductor substrate that comprises surface semiconductor regions of different crystal orientations located directly on a semiconductor base layer, and removing the semiconductor base layer, thereby forming a multi-orientation SOI substrate structure that comprises surface semiconductor regions of different crystal orientations located directly on the insulator layer.
Public/Granted literature
- US20070202635A1 MULTI-ORIENTATION SEMICONDUCTOR-ON-INSULATOR (SOI) SUBSTRATE, AND METHOD OF FABRICATING SAME Public/Granted day:2007-08-30
Information query
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