发明授权
- 专利标题： Electronic unit with a substrate where an electronic circuit is fabricated
- 专利标题（中）： 具有制造电子电路的基板的电子单元
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申请号： US11151660申请日： 2005-06-14
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公开(公告)号： US07531852B2公开(公告)日： 2009-05-12
- 发明人: Nobumasa Ueda , Hirokazu Kasuya , Koji Numazaki , Yutaka Fukuda , Mitsuhiro Saitou
- 申请人： Nobumasa Ueda , Hirokazu Kasuya , Koji Numazaki , Yutaka Fukuda , Mitsuhiro Saitou
- 申请人地址： JP Kariya
- 专利权人： DENSO CORPORATION
- 当前专利权人： DENSO CORPORATION
- 当前专利权人地址： JP Kariya
- 代理机构： Posz Law Group, PLC
- 优先权： JP2004-175585 20040614; JP2004-193556 20040630; JP2004-193558 20040630; JP2004-348544 20041201
- 主分类号： H01L21/82
- IPC分类号： H01L21/82
摘要：
In an electronic unit with a substrate, a control circuit is mounted on the substrate and is configured to execute an operation related to a load. A package encapsulates the control circuit and the substrate. The package has sides around a periphery of the substrate. At least one input terminal for input of a signal externally sent to the electronic unit is disposed on at least one of the plurality of surfaces. At least one output terminal for output of a control signal for controlling the load is disposed on at least another one of the plurality of surfaces. At least one check terminal for input/output of a signal for checking at least the control circuit is disposed on at least another one of the plurality of surfaces.
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