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34 条记录 (耗时 0.03 秒)

    Electronic unit with a substrate where an electronic circuit is fabricated
    3.
    发明申请
    Electronic unit with a substrate where an electronic circuit is fabricated 有权
    具有制造电子电路的基板的电子单元

    公开(公告)号：US20050274982A1

    公开(公告)日：2005-12-15

    申请号：US11151660

    申请日：2005-06-14

    申请人： Nobumasa Ueda ,  Hirokazu Kasuya ,  Koji Numazaki ,  Yutaka Fukuda ,  Mitsuhiro Saitou

    发明人： Nobumasa Ueda ,  Hirokazu Kasuya ,  Koji Numazaki ,  Yutaka Fukuda ,  Mitsuhiro Saitou

    IPC分类号： H01L23/34 ,  H01L27/02 ,  H01L29/861

    CPC分类号： H01L29/8611 ,  H01L2924/0002 ,  H01L2924/00

    摘要： In an electronic unit with a substrate, a control circuit is mounted on the substrate and is configured to execute an operation related to a load. A package encapsulates the control circuit and the substrate. The package has sides around a periphery of the substrate. At least one input terminal for input of a signal externally sent to the electronic unit is disposed on at least one of the plurality of surfaces. At least one output terminal for output of a control signal for controlling the load is disposed on at least another one of the plurality of surfaces. At least one check terminal for input/output of a signal for checking at least the control circuit is disposed on at least another one of the plurality of surfaces.

    摘要翻译： 在具有基板的电子单元中，控制电路安装在基板上，并且被配置为执行与负载相关的操作。 封装封装了控制电路和基板。 该封装具有围绕基板周边的侧面。 用于输入外部发送到电子单元的信号的至少一个输入端设置在多个表面中的至少一个表面上。 用于输出用于控制负载的控制信号的至少一个输出端子设置在多个表面中的至少另一个表面上。 至少一个用于输入/输出用于至少检查控制电路的信号的检查端子设置在多个表面中的至少另一个表面上。

    Electronic unit with a substrate where an electronic circuit is fabricated
    4.
    发明授权
    Electronic unit with a substrate where an electronic circuit is fabricated 有权
    具有制造电子电路的基板的电子单元

    公开(公告)号：US07531852B2

    公开(公告)日：2009-05-12

    申请号：US11151660

    申请日：2005-06-14

    申请人： Nobumasa Ueda ,  Hirokazu Kasuya ,  Koji Numazaki ,  Yutaka Fukuda ,  Mitsuhiro Saitou

    发明人： Nobumasa Ueda ,  Hirokazu Kasuya ,  Koji Numazaki ,  Yutaka Fukuda ,  Mitsuhiro Saitou

    IPC分类号： H01L21/82

    CPC分类号： H01L29/8611 ,  H01L2924/0002 ,  H01L2924/00

    摘要： In an electronic unit with a substrate, a control circuit is mounted on the substrate and is configured to execute an operation related to a load. A package encapsulates the control circuit and the substrate. The package has sides around a periphery of the substrate. At least one input terminal for input of a signal externally sent to the electronic unit is disposed on at least one of the plurality of surfaces. At least one output terminal for output of a control signal for controlling the load is disposed on at least another one of the plurality of surfaces. At least one check terminal for input/output of a signal for checking at least the control circuit is disposed on at least another one of the plurality of surfaces.

    摘要翻译： 在具有基板的电子单元中，控制电路安装在基板上，并且被配置为执行与负载相关的操作。 封装封装了控制电路和基板。 该封装具有围绕基板周边的侧面。 用于输入外部发送到电子单元的信号的至少一个输入端设置在多个表面中的至少一个表面上。 用于输出用于控制负载的控制信号的至少一个输出端子设置在多个表面中的至少另一个表面上。 至少一个用于输入/输出用于至少检查控制电路的信号的检查端子设置在多个表面中的至少另一个表面上。

    Semiconductor package with pocket for sealing material
    10.
    发明授权
    Semiconductor package with pocket for sealing material 失效
    半导体封装带口袋密封材料

    公开(公告)号：US5917246A

    公开(公告)日：1999-06-29

    申请号：US620580

    申请日：1996-03-22

    申请人： Hirokazu Kasuya ,  Kouji Numazaki ,  Takahisa Koyasu ,  Mitsuhiro Saitou

    发明人： Hirokazu Kasuya ,  Kouji Numazaki ,  Takahisa Koyasu ,  Mitsuhiro Saitou

    IPC分类号： H01L23/28 ,  H01L21/56 ,  H01L23/24 ,  H01L23/29 ,  H01L23/31 ,  H05K3/28 ,  H05K3/34

    CPC分类号： H01L23/24 ,  H01L21/56 ,  H01L2224/45144 ,  H01L2224/48091 ,  H05K3/284 ,  H05K3/3405

    摘要： A semiconductor package, which secures the protection of circuit elements from the external environment, is disclosed. A single in-line package (SIP) is constructed by fixingly sealing a hybrid integrated circuit component within a casing with epoxy resin. A sleeve is bonded on the surface of a ceramic substrate. The sleeve is formed with silicon rubber into a pocket shape so as to cover respective circuit elements of the hybrid integrated circuit component. In the sleeve is made an opening part. Silicon gel is poured into the sleeve as a fixingly sealing material and cured to seal the respective circuit elements. Terminals downwardly extends in parallel with each other from an end part of the ceramic substrate through an opening part of the casing.

    摘要翻译： 公开了一种确保电路元件与外部环境的保护的半导体封装。 单个在线封装（SIP）是通过将环形树脂固定密封在壳体内的混合集成电路部件构成的。 套筒结合在陶瓷基板的表面上。 套筒由硅橡胶形成为袋形，以覆盖混合集成电路部件的各个电路元件。 在袖子里打开了一部分。 将硅胶作为固定密封材料倒入套筒中并固化以密封各个电路元件。 端子从陶瓷基板的端部通过壳体的开口部向下平行地延伸。