发明授权
- 专利标题： Methods for hermetic sealing of post media-filled MEMS package
- 专利标题（中）： 填充后填充的MEMS封装的密封方法
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申请号： US11127915申请日： 2005-05-11
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公开(公告)号： US07534662B2公开(公告)日： 2009-05-19
- 发明人: Chien-Hua Chen , Charles C. Haluzak , Donald Michael
- 申请人： Chien-Hua Chen , Charles C. Haluzak , Donald Michael
- 申请人地址： US TX Houston
- 专利权人： Hewlett-Packard Development Company, L.P.
- 当前专利权人： Hewlett-Packard Development Company, L.P.
- 当前专利权人地址： US TX Houston
- 主分类号： H01L21/00
- IPC分类号： H01L21/00 ; H01L23/22
摘要：
This invention provides a system and method for hermetically sealing a post media-filled package with a metal cap. The method can include the operation of filling a MEMS package through a fill port with at least one medium. A further operation can be plugging the fill port in the MEMS package with a sealant. Another operation can include depositing a metal cap over the sealant to hermetically seal the fill port.
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