- 专利标题: Memory device and fabrication method thereof
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申请号: US11790047申请日: 2007-04-23
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公开(公告)号: US07538385B2公开(公告)日: 2009-05-26
- 发明人: Yoo-Cheol Shin , Jeong-Hyuk Choi , Sung-Hoi Hur
- 申请人: Yoo-Cheol Shin , Jeong-Hyuk Choi , Sung-Hoi Hur
- 申请人地址: KR Gyeonggi-do
- 专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人地址: KR Gyeonggi-do
- 代理机构: Harness, Dickey & Pierce PLC
- 优先权: KR10-2002-0028647 20020523
- 主分类号: H01L29/788
- IPC分类号: H01L29/788
摘要:
A method of forming a memory device, where a first insulator layer and a charge trapping layer may be formed on a substrate, and at least one of the first insulator layer and charge trapping layer may be patterned to form patterned areas. A second insulation layer and a conductive layer may be formed on the patterned areas, and one or more of the conductive layer, second insulator layer, charge trapping layer and first insulator layer may be patterned to form a string selection line, ground selection line, a plurality of word lines between the string selection and ground selection lines on the substrate, a low voltage gate electrode, and a plurality of insulators of varying thickness. The formed memory device may be a NAND-type non-volatile memory device having a SONOS gate structure, for example.
公开/授权文献
- US20070252194A1 Memory device and fabrication method thereof 公开/授权日:2007-11-01
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