发明授权
US07539016B2 Electromagnetically-actuated micropump for liquid metal alloy enclosed in cavity with flexible sidewalls
失效
用于液态金属合金的电磁致动微型泵封装在具有柔性侧壁的空腔中
- 专利标题： Electromagnetically-actuated micropump for liquid metal alloy enclosed in cavity with flexible sidewalls
- 专利标题（中）： 用于液态金属合金的电磁致动微型泵封装在具有柔性侧壁的空腔中
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申请号： US11322495申请日： 2005-12-30
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公开(公告)号： US07539016B2公开(公告)日： 2009-05-26
- 发明人: Ioan Sauciuc , Ravi Mahajan
- 申请人： Ioan Sauciuc , Ravi Mahajan
- 申请人地址： US CA Santa Clara
- 专利权人： Intel Corporation
- 当前专利权人： Intel Corporation
- 当前专利权人地址： US CA Santa Clara
- 代理商 George Chen
- 主分类号： H05K7/20
- IPC分类号： H05K7/20 ; F04B43/14
摘要：
The present invention discloses a method of confining a liquid metal alloy within a closed-loop system; distributing a first portion of the liquid metal alloy in a cavity within the closed-loop system; turning on an electromagnet to generate a magnetic field to permeate flexible sidewalls of the cavity; attracting the liquid metal alloy in the cavity towards the electromagnet to expand the flexible sidewalls; inducing a second portion of the liquid metal alloy to enter the cavity from an inlet end of a pipe within the closed-loop system; turning off the electromagnet; repelling the liquid metal alloy in the cavity away from the electromagnet to contract the flexible sidewalls; and inducing a third portion of the liquid metal alloy to exit the cavity to an outlet end of the pipe.
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