Invention Grant
- Patent Title: Mounting structure of speed reduction device and brake device of vehicle
- Patent Title (中): 减速装置和车辆制动装置的安装结构
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Application No.: US11678765Application Date: 2007-02-26
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Publication No.: US07540360B2Publication Date: 2009-06-02
- Inventor: Bunzo Seki , Shigeto Inami
- Applicant: Bunzo Seki , Shigeto Inami
- Applicant Address: JP Tokyo
- Assignee: Honda Motor Co., Ltd.
- Current Assignee: Honda Motor Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Westerman, Hattori, Daniels & Adrian, LLP.
- Priority: JP2006-051335 20060227
- Main IPC: B62L5/00
- IPC: B62L5/00

Abstract:
A mounting structure for a speed reduction device of a vehicle includes a vehicle frame, a casing mounted on the vehicle frame at a casing mounting portion, a brake caliper mounted to the casing at a caliper mounting portion, a brake disc mounted on a drive axle of the vehicle, and a clamping portion mounted on the brake caliper for applying clamping force to the brake disc. The clamping portion, the caliper mounting portion, and the casing mounting portion are positioned on a substantially straight line, and are positioned substantially parallel to the direction of braking force.
Public/Granted literature
- US20070199776A1 MOUNTING STRUCTURE OF SPEED REDUCTION DEVICE AND BRAKE DEVICE OF VEHICLE Public/Granted day:2007-08-30
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