发明授权
US07541265B2 Capacitor material for use in circuitized substrates, circuitized substrate utilizing same, method of making said circuitized substrate, and information handling system utilizing said circuitized substrate
有权
用于电路化基板的电容器材料，利用其的电路化基板，制造所述电路化基板的方法和利用所述电路化基板的信息处理系统
- 专利标题： Capacitor material for use in circuitized substrates, circuitized substrate utilizing same, method of making said circuitized substrate, and information handling system utilizing said circuitized substrate
- 专利标题（中）： 用于电路化基板的电容器材料，利用其的电路化基板，制造所述电路化基板的方法和利用所述电路化基板的信息处理系统
-
申请号： US11031085申请日： 2005-01-10
-
公开(公告)号： US07541265B2公开(公告)日： 2009-06-02
- 发明人: Rabindra N. Das , John M. Lauffer , Kostas I. Papathomas , Mark D. Poliks
- 申请人： Rabindra N. Das , John M. Lauffer , Kostas I. Papathomas , Mark D. Poliks
- 申请人地址： US NY Endicott
- 专利权人： Endicott Interconnect Technologies, Inc.
- 当前专利权人： Endicott Interconnect Technologies, Inc.
- 当前专利权人地址： US NY Endicott
- 代理机构： Hinman, Howard & Kattell
- 代理商 Mark Levy; Lawrence R. Fraley
- 主分类号： H01L21/425
- IPC分类号： H01L21/425
摘要：
A material for use as part of an internal capacitor within a circuitized substrate includes a polymer (e.g., a cycloaliphatic epoxy or phenoxy based) resin and a quantity of nano-powders of ferroelectric ceramic material (e.g., barium titanate) having a particle size substantially in the range of from about 0.01 microns to about 0.90 microns and a surface area for selected ones of said particles within the range of from about 2.0 to about 20 square meters per gram. A circuitized substrate adapted for using such a material and capacitor therein and a method of making such a substrate are also provided. An electrical assembly (substrate and at least one electrical component) and an information handling system (e.g., personal computer) are also provided.
公开/授权文献
信息查询
IPC分类:
