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发明授权
US07541662B2 Packaging chip having inductor therein 失效
具有电感器的封装芯片

Packaging chip having inductor therein
摘要：
A packaging chip having inductors therein is provided. The packaging chip includes a substrate for mounting a circuit element therein, at least one port formed on a surface of the substrate, a sealing portion electrically connected on the substrate to the circuit element and the at least one port, respectively, and a packaging substrate bonded to the substrate through the sealing portion and packaging the circuit element. In this case, the sealing portion has a certain magnitude of inductance since it is formed of a conductive material, thereby serving as an inductor. Accordingly, the packaging chip having an inductor therein can be implemented in a small size.
摘要（中）：

提供其中具有电感器的封装芯片。 封装芯片包括用于在其中安装电路元件的基板，形成在基板的表面上的至少一个端口，分别电连接到基板上的电路元件和至少一个端口的密封部分和封装基板 通过密封部分粘合到基板上并封装电路元件。 在这种情况下，密封部分具有一定的电感量，因为其由导电材料形成，从而用作电感器。 因此，其中具有电感器的封装芯片可以实现为小尺寸。

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