An electronic component has a structure which prevents corrosion caused by moisture intrusion through an electrode pattern extending inwardly from an edge connecting a side and one of main surfaces of a substrate and, therefore, deterioration of a characteristic rarely occurs over time. The electronic component includes, on the first main surface of the substrate, the first electrode pattern extending inwardly from an edge connecting the side of the substrate and the first main surface of the substrate, the second electrode pattern that is opposite to the end of the first electrode pattern through the gap, and the third electrode pattern that is disposed on the first electrode pattern and the second electrode pattern such that it covers the gap. The third electrode pattern is formed from a metal film that is highly resistant to corrosion, the corrosion resistance of which is superior to that of metal films forming the first electrode pattern and the second electrode pattern.