Electronic component and manufacturing method thereof
    1.
    发明授权
    Electronic component and manufacturing method thereof 有权
    电子元器件及其制造方法

    公开(公告)号:US07541722B2

    公开(公告)日:2009-06-02

    申请号:US12100459

    申请日:2008-04-10

    IPC分类号: H01L41/047

    摘要: An electronic component has a structure which prevents corrosion caused by moisture intrusion through an electrode pattern extending inwardly from an edge connecting a side and one of main surfaces of a substrate and, therefore, deterioration of a characteristic rarely occurs over time. The electronic component includes, on the first main surface of the substrate, the first electrode pattern extending inwardly from an edge connecting the side of the substrate and the first main surface of the substrate, the second electrode pattern that is opposite to the end of the first electrode pattern through the gap, and the third electrode pattern that is disposed on the first electrode pattern and the second electrode pattern such that it covers the gap. The third electrode pattern is formed from a metal film that is highly resistant to corrosion, the corrosion resistance of which is superior to that of metal films forming the first electrode pattern and the second electrode pattern.

    摘要翻译: 电子部件具有这样的结构,其防止湿气侵入通过从连接基板的一侧和一个主面的边缘向内延伸的电极图案而引起的腐蚀,因此,随着时间的推移,特性的劣化很少发生。 电子部件在基板的第一主表面上包括从连接基板的一侧和基板的第一主表面的边缘向内延伸的第一电极图案,与第二电极图案相对的第二电极图案 通过所述间隙的第一电极图案,以及设置在所述第一电极图案和所述第二电极图案上使得其覆盖所述间隙的所述第三电极图案。 第三电极图案由耐腐蚀性高的金属膜形成,其耐腐蚀性优于形成第一电极图案和第二电极图案的金属膜的耐腐蚀性。

    ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF
    2.
    发明申请
    ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF 有权
    电子元器件及其制造方法

    公开(公告)号:US20080179991A1

    公开(公告)日:2008-07-31

    申请号:US12100459

    申请日:2008-04-10

    IPC分类号: H03H9/25

    摘要: An electronic component has a structure which prevents corrosion caused by moisture intrusion through an electrode pattern extending inwardly from an edge connecting a side and one of main surfaces of a substrate and, therefore, deterioration of a characteristic rarely occurs over time. The electronic component includes, on the first main surface of the substrate, the first electrode pattern extending inwardly from an edge connecting the side of the substrate and the first main surface of the substrate, the second electrode pattern that is opposite to the end of the first electrode pattern through the gap, and the third electrode pattern that is disposed on the first electrode pattern and the second electrode pattern such that it covers the gap. The third electrode pattern is formed from a metal film that is highly resistant to corrosion, the corrosion resistance of which is superior to that of metal films forming the first electrode pattern and the second electrode pattern.

    摘要翻译: 电子部件具有这样的结构,其防止湿气侵入通过从连接基板的一侧和一个主面的边缘向内延伸的电极图案而引起的腐蚀,因此,随着时间的推移,特性的劣化很少发生。 电子部件在基板的第一主表面上包括从连接基板的一侧和基板的第一主表面的边缘向内延伸的第一电极图案,与第二电极图案相对的第二电极图案 通过所述间隙的第一电极图案,以及设置在所述第一电极图案和所述第二电极图案上使得其覆盖所述间隙的所述第三电极图案。 第三电极图案由耐腐蚀性高的金属膜形成,其耐腐蚀性优于形成第一电极图案和第二电极图案的金属膜的耐腐蚀性。