发明授权
- 专利标题： Electronic parts packaging structure
- 专利标题（中）： 电子零件包装结构
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申请号： US11362189申请日： 2006-02-27
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公开(公告)号： US07545049B2公开(公告)日： 2009-06-09
- 发明人: Masahiro Sunohara , Kei Murayama , Toshinori Koyama , Kazutaka Kobayashi , Mitsutoshi Higashi
- 申请人： Masahiro Sunohara , Kei Murayama , Toshinori Koyama , Kazutaka Kobayashi , Mitsutoshi Higashi
- 申请人地址： JP Nagano
- 专利权人： Shinko Electric Industries Co., Ltd.
- 当前专利权人： Shinko Electric Industries Co., Ltd.
- 当前专利权人地址： JP Nagano
- 代理机构： Kratz, Quintos & Hanson, LLP.
- 优先权： JP2003-035156 20030213
- 主分类号： H01L23/48
- IPC分类号： H01L23/48 ; H01L23/52 ; H01L29/40
摘要：
An electronic parts packaging structure of the present invention includes a wiring substrate having a wiring pattern, a first insulating film which is formed on the wiring substrate and which has an opening portion in a packaging area where an electronic parts is mounted, the electronic parts having a connection terminal flip-chip mounted on the wiring pattern exposed in the opening portion of the first insulating film, a second insulating film for covering the electronic parts, a via hole formed in a predetermined portion of the first and second insulating films on the wiring pattern, and an upper wiring pattern formed on the second insulating film and connected to the wiring pattern through the via hole.
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