发明授权
- 专利标题： Method for coating a structure comprising semiconductor chips
- 专利标题（中）： 涂覆包含半导体芯片的结构的方法
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申请号： US11504782申请日： 2006-08-16
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公开(公告)号： US07547645B2公开(公告)日： 2009-06-16
- 发明人: Michael Bauer , Ludwig Heitzer , Jens Pohl , Peter Strobel , Christian Stuempfl
- 申请人： Michael Bauer , Ludwig Heitzer , Jens Pohl , Peter Strobel , Christian Stuempfl
- 申请人地址： DE Neubiberg
- 专利权人： Infineon Technologies AG
- 当前专利权人： Infineon Technologies AG
- 当前专利权人地址： DE Neubiberg
- 代理机构： Edell, Shapiro & Finnan, LLC
- 优先权： DE102005038956 20050816
- 主分类号： H01L21/20
- IPC分类号： H01L21/20
摘要：
A method for coating a structure that includes at least one semiconductor chip involves electrostatically depositing coating particles on the areas of the structure to be coated. The coating particles are first applied to a carrier and the latter is electrostatically charged with the coating particles. The structure including at least one semiconductor chip is charged electrostatically to a polarity opposite to the carrier. The carrier and/or the structure are then moved towards one another in the direction of an area of the structure to be coated until the coating particles jump to the areas of the structure to be coated and adhere there. The coating particles are liquefied by heating the area with coating particles to form a coating.
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