发明授权
- 专利标题： Electronic package and semiconductor device using the same
- 专利标题（中）： 电子封装和使用相同的半导体器件
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申请号： US11892093申请日： 2007-08-20
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公开(公告)号： US07550829B2公开(公告)日： 2009-06-23
- 发明人: Takekazu Tanaka
- 申请人： Takekazu Tanaka
- 申请人地址： JP Kawasaki, Kanagawa
- 专利权人： NEC Electronics Corporation
- 当前专利权人： NEC Electronics Corporation
- 当前专利权人地址： JP Kawasaki, Kanagawa
- 代理机构： McGinn IP Law Group, PLLC
- 优先权： JP2004-193003 20040630
- 主分类号： H01L23/495
- IPC分类号： H01L23/495
摘要：
A package for an electronic component including a chip mounting area mounting a semiconductor chip in a hollow part of a metal plate and a plurality of connection electrodes to be connected to a substrate. The plurality of connection electrodes are formed in opposite sides of the rectangular metal plate and arranged asymmetrically with respect to a perpendicular bisector of the opposite sides.
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