Invention Grant
- Patent Title: Compression of resin impregnated insulating tapes
- Patent Title (中): 树脂浸渍绝缘胶带的压缩
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Application No.: US11106845Application Date: 2005-04-15
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Publication No.: US07553438B2Publication Date: 2009-06-30
- Inventor: James D Smith , Gary Stevens , John W Wood , Andreas Lutz
- Applicant: James D Smith , Gary Stevens , John W Wood , Andreas Lutz
- Applicant Address: US FL Orlando
- Assignee: Siemens Energy, Inc.
- Current Assignee: Siemens Energy, Inc.
- Current Assignee Address: US FL Orlando
- Main IPC: B29C43/20
- IPC: B29C43/20 ; B29C43/58 ; B29C45/14 ; H02K15/12
Abstract:
The present invention provides for a method of impregnating a matrix with a high thermal conductivity filled resin 32, which produces a resin impregnated matrix. The high thermal conductivity material 30 comprises 5-60% by volume of the resin 32. This is compressed by approximately 5-30%, and the distances between the high thermal conductivity materials loaded in the resin are reduced, and the resin is then cured.
Public/Granted literature
- US20050274450A1 Compression of resin impregnated insulating tapes Public/Granted day:2005-12-15
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