发明授权
- 专利标题: Semiconductor device and method for manufacturing the same
- 专利标题(中): 半导体装置及其制造方法
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申请号: US11434124申请日: 2006-05-16
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公开(公告)号: US07553722B2公开(公告)日: 2009-06-30
- 发明人: Jun Sakakibara , Hitoshi Yamaguchi , Naohiro Suzuki
- 申请人: Jun Sakakibara , Hitoshi Yamaguchi , Naohiro Suzuki
- 申请人地址: JP Kariya
- 专利权人: DENSO CORPORATION
- 当前专利权人: DENSO CORPORATION
- 当前专利权人地址: JP Kariya
- 代理机构: Posz Law Group, PLC
- 优先权: JP2005-164492 20050603
- 主分类号: H01L21/8242
- IPC分类号: H01L21/8242
摘要:
A semiconductor device includes: a semiconductor substrate having a first surface and a second surface, wherein the substrate has a first conductive type; a first trench extending from the first surface of the semiconductor substrate in a depth direction; and an epitaxial semiconductor layer having a second conductive type, wherein the epitaxial semiconductor layer is disposed in the first trench. The first trench includes an inner wall as an interface between the semiconductor substrate and the epitaxial semiconductor layer so that the interface provides a PN junction. The first trench has an aspect ratio equal to or larger than 1.
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