发明授权
- 专利标题: Latent curing agent
- 专利标题(中): 潜在固化剂
-
申请号: US11884527申请日: 2006-06-02
-
公开(公告)号: US07557230B2公开(公告)日: 2009-07-07
- 发明人: Katsuhiko Komuro , Tadasu Kawashima , Masahiko Ito , Daisuke Masuko
- 申请人: Katsuhiko Komuro , Tadasu Kawashima , Masahiko Ito , Daisuke Masuko
- 申请人地址: JP Tokyo JP Tokyo
- 专利权人: Sony Corporation,Sony Chemical & Information Device Corporation
- 当前专利权人: Sony Corporation,Sony Chemical & Information Device Corporation
- 当前专利权人地址: JP Tokyo JP Tokyo
- 代理机构: Oliff & Berridge, PLC
- 优先权: JP2005-165093 20050606; JP2006-026912 20060203
- 国际申请: PCT/JP2006/011054 WO 20060602
- 国际公布: WO2006/132133 WO 20061214
- 主分类号: C07F7/02
- IPC分类号: C07F7/02 ; C11D3/39
摘要:
An aluminum chelate-based latent curing agent capable of curing a thermosetting epoxy resin under the condition of relatively low temperature in a short period of time is provided. Furthermore, a method for manufacturing the latent curing agent is provided, in which the curing conditions of the aluminum chelate-based latent curing agent can be controlled relatively easily.The aluminum chelate-based latent curing agent is prepared by reacting an aluminum chelate agent with a silsesquioxane type oxetane derivative in the presence of a water insoluble or poorly water-soluble cellulose ether, whereby latency properties are imparted thereto. This latent curing agent contains a coating layer composed of the water insoluble or poorly water-soluble cellulose ether. Preferably, the surface is treated with an isocyanate compound.
公开/授权文献
- US20080161589A1 Latent Curing Agent 公开/授权日:2008-07-03
信息查询