Package cap with bypass capacitance

Invention Grant

US07557425B2 Package cap with bypass capacitance 失效

Title translation: 具有旁路电容的封装盖

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Patent Title: Package cap with bypass capacitance
Patent Title (中): 具有旁路电容的封装盖
Application No.: US11130744

Application Date: 2005-05-17
Publication No.: US07557425B2

Publication Date: 2009-07-07
Inventor: Lance L. Sundstrom
Applicant: Lance L. Sundstrom
Applicant Address: US NJ Morristown
Assignee: Honeywell International Inc.
Current Assignee: Honeywell International Inc.
Current Assignee Address: US NJ Morristown
Agency: McDonnell Boehnen Hulbert & Berghoff LLP
Main IPC: H01L29/00
IPC: H01L29/00

Abstract:

An integrated circuit package is provided. The package comprises a lid which is adapted to cover an integrated circuit, the lid is further adapted to provide bypass capacitance to the integrated circuit.

Abstract(Chinese):

提供集成电路封装。封装包括适于覆盖集成电路的盖，盖还适于向集成电路提供旁路电容。

Public/Granted literature

US20060261466A1 Package cap Public/Granted day:2006-11-23

Information query

Espacenet

IPC分类:

H	电学
H01	基本电气元件
H01L	半导体器件；其他类目中不包括的电固体器件（使用半导体器件的测量入G01；一般电阻器入H01C；磁体、电感器、变压器入H01F；一般电容器入H01G；电解型器件入H01G9/00；电池组、蓄电池入H01M；波导管、谐振器或波导型线路入H01P；线路连接器、汇流器入H01R；受激发射器件入H01S；机电谐振器入H03H；扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R；一般电光源入H05B；印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K；在具有特殊应用的电路中使用的半导体器件见应用相关的小类）
H01L29/00	专门适用于整流、放大、振荡或切换，并具有至少一个电位跃变势垒或表面势垒的半导体器件；具有至少一个电位跃变势垒或表面势垒，例如PN结耗尽层或载流子集结层的电容器或电阻器；半导体本体或其电极的零部件（H01L31/00至H01L47/00，H01L51/05优先；除半导体或其电极之外的零部件入H01L23/00；由在一个共用衬底内或其上形成的多个固态组件组成的器件入H01L27/00）