发明授权
- 专利标题: Cooling apparatus
- 专利标题(中): 冷却装置
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申请号: US11195418申请日: 2005-08-01
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公开(公告)号: US07558064B2公开(公告)日: 2009-07-07
- 发明人: Kazuhiro Nakamura , Tetsuya Shimada , Katsuhiko Watabe
- 申请人: Kazuhiro Nakamura , Tetsuya Shimada , Katsuhiko Watabe
- 申请人地址: JP Osaka
- 专利权人: Espec Corp.
- 当前专利权人: Espec Corp.
- 当前专利权人地址: JP Osaka
- 代理机构: Jordan and Hamburg LLP
- 优先权: JP2004-224841 20040730
- 主分类号: H05K7/20
- IPC分类号: H05K7/20 ; G01R31/02 ; F28B9/00
摘要:
The cooling apparatus comprises an air supply system, a water supply system, and a sprayer, and has a structure such that water and compressed air are mixed and the air is sprayed together with the water converted into mist onto the upper surface of a device attached to a socket of a burn-in board. The heat generated by the device is removed via the mist and air that falls on the upper surface. When a burn-in test is conducted the cooling apparatus adjusts the water and air supply so that the device is cooled to the target temperature.
公开/授权文献
- US20060023424A1 Cooling apparatus 公开/授权日:2006-02-02
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