发明授权
US07560812B2 Cooling module against ESD and electronic package, assembly and system using the same
有权
冷却模块防静电和电子封装，组装和系统使用相同
- 专利标题： Cooling module against ESD and electronic package, assembly and system using the same
- 专利标题（中）： 冷却模块防静电和电子封装，组装和系统使用相同
-
申请号： US11554046申请日： 2006-10-30
-
公开(公告)号： US07560812B2公开(公告)日： 2009-07-14
- 发明人: Kevin Kuo , Stanley Huang , Cheng-Ming Hsu , Neng-An Kuo
- 申请人： Kevin Kuo , Stanley Huang , Cheng-Ming Hsu , Neng-An Kuo
- 申请人地址： TW Taipei Hsien
- 专利权人： VIA Technologies, Inc.
- 当前专利权人： VIA Technologies, Inc.
- 当前专利权人地址： TW Taipei Hsien
- 代理机构： Jiang Chyun IP Office
- 优先权： TW95126013A 20060717
- 主分类号： H01L23/10
- IPC分类号： H01L23/10 ; H01L23/34
摘要：
An electronic assembly includes a substrate, a chip, a conductive fence and a heat sink. The substrate has a bonding surface. The chip is bonded to the bonding surface. The conductive fence connects the bonding surface and at least locally surrounds the sides of the chip. The heat sink is disposed over the substrate and contacts the chip and the conductive fence. By disposing the conductive fence between the substrate and the heat sink, the conductive fence and the heat sink can further function as the shields of the chip to reduce any adverse influence of an ESD current on the chip.
公开/授权文献
信息查询
IPC分类:
