公开(公告)号：US20080012123A1

公开(公告)日：2008-01-17

申请号：US11554046

申请日：2006-10-30

申请人： Kevin Kuo ,  Stanley Huang ,  Cheng-Ming Hsu ,  Neng-An Kuo

发明人： Kevin Kuo ,  Stanley Huang ,  Cheng-Ming Hsu ,  Neng-An Kuo

IPC分类号： H01L23/34

CPC分类号： H01L23/60 ,  H01L23/367 ,  H01L2224/16225 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/3025 ,  H01L2224/0401

摘要： An electronic assembly includes a substrate, a chip, a conductive fence and a heat sink. The substrate has a bonding surface. The chip is bonded to the bonding surface. The conductive fence connects the bonding surface and at least locally surrounds the sides of the chip. The heat sink is disposed over the substrate and contacts the chip and the conductive fence. By disposing the conductive fence between the substrate and the heat sink, the conductive fence and the heat sink can further function as the shields of the chip to reduce any adverse influence of an ESD current on the chip.

摘要翻译： 电子组件包括基板，芯片，导电栅栏和散热器。 基板具有接合表面。 芯片结合到接合表面。 导电栅栏连接接合表面，并且至少局部地围绕芯片的侧面。 散热器设置在基板上并与芯片和导电栅栏接触。 通过将导电栅栏设置在基板和散热片之间，导电栅栏和散热器可进一步起到芯片的屏蔽的作用，以减少ESD电流对芯片的不利影响。

公开(公告)号：USD687433S1

公开(公告)日：2013-08-06

申请号：US29430263

申请日：2012-08-23

申请人： Chia-Yi Lin ,  Neng-An Kuo

设计人： Chia-Yi Lin ,  Neng-An Kuo

公开(公告)号：US07560812B2

公开(公告)日：2009-07-14

申请号：US11554046

申请日：2006-10-30

申请人： Kevin Kuo ,  Stanley Huang ,  Cheng-Ming Hsu ,  Neng-An Kuo

发明人： Kevin Kuo ,  Stanley Huang ,  Cheng-Ming Hsu ,  Neng-An Kuo

IPC分类号： H01L23/10 ,  H01L23/34

CPC分类号： H01L23/60 ,  H01L23/367 ,  H01L2224/16225 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/3025 ,  H01L2224/0401

摘要： An electronic assembly includes a substrate, a chip, a conductive fence and a heat sink. The substrate has a bonding surface. The chip is bonded to the bonding surface. The conductive fence connects the bonding surface and at least locally surrounds the sides of the chip. The heat sink is disposed over the substrate and contacts the chip and the conductive fence. By disposing the conductive fence between the substrate and the heat sink, the conductive fence and the heat sink can further function as the shields of the chip to reduce any adverse influence of an ESD current on the chip.

摘要翻译： 电子组件包括基板，芯片，导电栅栏和散热器。 基板具有接合表面。 芯片结合到接合表面。 导电栅栏连接接合表面，并且至少局部地围绕芯片的侧面。 散热器设置在基板上并与芯片和导电栅栏接触。 通过将导电栅栏设置在基板和散热片之间，导电栅栏和散热器可进一步起到芯片的屏蔽的作用，以减少ESD电流对芯片的不利影响。