发明授权
- 专利标题： Interconnect including a pliable surface and use thereof
- 专利标题（中）： 互连包括柔韧的表面和使用
-
申请号： US11312061申请日： 2005-12-20
-
公开(公告)号： US07560817B2公开(公告)日： 2009-07-14
- 发明人: Nagesh R. Basavanhally , Raymond A. Cirelli , Omar D. Lopez
- 申请人： Nagesh R. Basavanhally , Raymond A. Cirelli , Omar D. Lopez
- 申请人地址： US NJ Murray Hill
- 专利权人： Alcatel-Lucent USA Inc.
- 当前专利权人： Alcatel-Lucent USA Inc.
- 当前专利权人地址： US NJ Murray Hill
- 主分类号： H01L23/48
- IPC分类号： H01L23/48
摘要：
The present invention provides an interconnect. The interconnect comprises a pliable surface having a plurality of nanostructures disposed thereon, the pliable surface configured to allow the plurality of nanostructures to at least partially conform to a surface when the nanostructures come into contact therewith.
公开/授权文献
- US20060097252A1 Interconnect including a pliable surface and use thereof 公开/授权日：2006-05-11