Invention Grant
- Patent Title: Wafer clamp having changeable supporting part
- Patent Title (中): 晶圆夹具有可变的支撑部分
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Application No.: US11798504Application Date: 2007-05-14
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Publication No.: US07562922B2Publication Date: 2009-07-21
- Inventor: Chih-Hung Wu , Hung-Sheng Chiu , Kai-Sheng Chang , Kuan-Yu Chu
- Applicant: Chih-Hung Wu , Hung-Sheng Chiu , Kai-Sheng Chang , Kuan-Yu Chu
- Applicant Address: TW Taoyuan
- Assignee: Atomic Energy Council-Institute of Nuclear Energy Research
- Current Assignee: Atomic Energy Council-Institute of Nuclear Energy Research
- Current Assignee Address: TW Taoyuan
- Main IPC: B25B9/02
- IPC: B25B9/02
Abstract:
A wafer clamp according to the present invention always firmly clamps a wafer. A supporting arm of the wafer clamp will be replaced with a different one according to the wafer size. Moreover, with a larger area of the supporting arm, a wear resistance and a smoothness of the wafer is improved. Besides, the wafer clamp stops the wafer from slipping. Hence, the present invention has a simple structure, a good practicality and a wide application.
Public/Granted literature
- US20080284082A1 Wafer clamp having changeable supporting part Public/Granted day:2008-11-20
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