发明授权
- 专利标题: Buffer architecture formed on a semiconductor wafer
- 专利标题(中): 形成在半导体晶圆上的缓冲结构
-
申请号: US11712614申请日: 2007-03-01
-
公开(公告)号: US07566898B2公开(公告)日: 2009-07-28
- 发明人: Mantu K. Hudait , Dmitri Loubychev , Suman Datta , Robert Chau , Joel M. Fastenau , Amy W. K. Liu
- 申请人: Mantu K. Hudait , Dmitri Loubychev , Suman Datta , Robert Chau , Joel M. Fastenau , Amy W. K. Liu
- 申请人地址: US CA Santa Clara
- 专利权人: Intel Corporation
- 当前专利权人: Intel Corporation
- 当前专利权人地址: US CA Santa Clara
- 代理机构: Trop, Pruner & Hu, P.C.
- 主分类号: H01L31/00
- IPC分类号: H01L31/00
摘要:
In one embodiment, the present invention includes an apparatus for forming a transistor that includes a silicon (Si) substrate, a dislocation filtering buffer formed over the Si substrate having a first buffer layer including gallium arsenide (GaAs) nucleation and buffer layers and a second buffer layer including a graded indium aluminium arsenide (InAlAs) buffer layer, a lower barrier layer formed on the second buffer layer formed of InAlAs, and a strained quantum well (QW) layer formed on the lower barrier layer of indium gallium arsenide (InGaAs). Other embodiments are described and claimed.
公开/授权文献
- US20080210927A1 Buffer architecture formed on a semiconductor wafer 公开/授权日:2008-09-04
信息查询
IPC分类: