Invention Grant
- Patent Title: Flexure including a heat sink and a dielectric layer under trace termination pads
- Patent Title (中): 挠曲包括散热器和跟踪端接垫下的电介质层
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Application No.: US11590575Application Date: 2006-10-31
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Publication No.: US07567410B1Publication Date: 2009-07-28
- Inventor: Yiduo Zhang , Drew B. Lawson , Tzong-Shii Pan , Darrell D. Palmer , Yih-Jen Chen
- Applicant: Yiduo Zhang , Drew B. Lawson , Tzong-Shii Pan , Darrell D. Palmer , Yih-Jen Chen
- Applicant Address: US CA Lake Forest
- Assignee: Western Digital Technologies, Inc.
- Current Assignee: Western Digital Technologies, Inc.
- Current Assignee Address: US CA Lake Forest
- Agency: Barcelo & Harrison, LLP
- Main IPC: G11B5/48
- IPC: G11B5/48

Abstract:
A flexure is provided for a HGA suspension. The flexure includes a metal base layer, a trace layer, and a dielectric layer disposed between the trace and base layers. The metal base layer includes a heat sink portion. The trace layer includes a plurality of conductive traces, each conductive trace having a curved section that terminates in a trace termination pad. The dielectric layer includes a portion that underlies the trace termination pads and overlies the heat sink portion. The base layer and the dielectric layer each also include a window. The curved section of each conductive trace extends over the window of the base layer. The curved section of each conductive trace may at least partially extend over the window of the dielectric layer.
Information query
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