发明授权
- 专利标题： Printed wiring board having a solder pad and a method for manufacturing the same
- 专利标题（中）： 具有焊盘的印刷线路板及其制造方法
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申请号： US11304770申请日： 2005-12-16
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公开(公告)号： US07568922B2公开(公告)日： 2009-08-04
- 发明人: Takahiro Yamashita , Hiroyuki Watanabe , Kiyotaka Tsukada , Michio Ido , Morio Nakao
- 申请人： Takahiro Yamashita , Hiroyuki Watanabe , Kiyotaka Tsukada , Michio Ido , Morio Nakao
- 申请人地址： JP Ogaki-shi
- 专利权人： IBIDEN Co., Ltd.
- 当前专利权人： IBIDEN Co., Ltd.
- 当前专利权人地址： JP Ogaki-shi
- 代理机构： Oblon, Spivak, McClelland, Maier & Neustadt, P.C.
- 优先权： JP2004-366287 20041217
- 主分类号： H01R12/00
- IPC分类号： H01R12/00 ; H05K1/00
摘要：
This invention provides a printed wiring board having an intensified drop impact resistance of a joint portion between pad and solder. An electrode pad comprises pad portion loaded with solder ball and a cylindrical portion projecting to the solder ball supporting the pad portion. An outer edge of the pad portion extends sideway from a cylindrical portion so that the outer edge is capable of bending. If the outer edge bends when stress is applied to the solder ball 30, stress on the outer edge of the pad portion on which stress is concentrated can be relaxed so as to intensify the joint strength between an electrode pad and solder ball.
公开/授权文献
- US20060169484A1 Printed wiring board 公开/授权日：2006-08-03
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