发明授权
- 专利标题: Thermoformable polyester-containing laminates
- 专利标题(中): 可热成型的含聚酯的层压板
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申请号: US11011673申请日: 2004-12-14
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公开(公告)号: US07569276B2公开(公告)日: 2009-08-04
- 发明人: Terrance D. Kendig , Warren S. Sobataka
- 申请人: Terrance D. Kendig , Warren S. Sobataka
- 申请人地址: US DE Wilmington
- 专利权人: DuPont Teijin Films U.S. Limited Partnership
- 当前专利权人: DuPont Teijin Films U.S. Limited Partnership
- 当前专利权人地址: US DE Wilmington
- 代理机构: RatnerPrestia
- 主分类号: B32B5/00
- IPC分类号: B32B5/00 ; B32B7/00 ; B32B15/08
摘要:
Disclosed is a thermoformable film laminate that can be useful for packaging comprising or produced from (a) a thermoformable film layer comprising or produced from a polymer composition having at least 80% by weight polyethylene terephthalate polymer, said film having an outer surface and an inner surface; (b) a film layer having a heat shrinkage of at least about 5% less than (a); (c) a heat sealable layer; and optionally, (d) an additional barrier layer.
公开/授权文献
- US20050136202A1 Thermoformable polyester-containing laminates 公开/授权日:2005-06-23
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