Invention Grant
- Patent Title: Method for manufacturing a diaphragm sensor
- Patent Title (中): 膜片传感器的制造方法
-
Application No.: US11011898Application Date: 2004-12-13
-
Publication No.: US07569412B2Publication Date: 2009-08-04
- Inventor: Hubert Benzel , Frank Schaefer , Simon Armbruster , Gerhard Lammel , Christoph Schelling , Joerg Brasas
- Applicant: Hubert Benzel , Frank Schaefer , Simon Armbruster , Gerhard Lammel , Christoph Schelling , Joerg Brasas
- Applicant Address: DE Stuttgart
- Assignee: Robert Bosch GmbH
- Current Assignee: Robert Bosch GmbH
- Current Assignee Address: DE Stuttgart
- Agency: Kenyon & Kenyon LLP
- Priority: DE10358859 20031216; DE102004036035 20040724
- Main IPC: H01L21/00
- IPC: H01L21/00
Abstract:
A method for producing a micromechanical diaphragm sensor includes providing a semiconductor substrate having a first region, a diaphragm, and a cavity that is located at least partially below the diaphragm. Above at least one part of the first region, a second region is generated in or on the surface of the semiconductor substrate, with at least one part of the second region being provided as crosspieces. The diaphragm is formed by a deposited sealing layer, and includes at least a part of the crosspieces.
Public/Granted literature
Information query
IPC分类:
