Invention Grant
US07569418B2 Methods for securing packaged semiconductor devices to carrier substrates
失效
将封装的半导体器件固定到载体衬底的方法
- Patent Title: Methods for securing packaged semiconductor devices to carrier substrates
- Patent Title (中): 将封装的半导体器件固定到载体衬底的方法
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Application No.: US11219214Application Date: 2005-09-01
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Publication No.: US07569418B2Publication Date: 2009-08-04
- Inventor: Larry D. Kinsman , Walter L. Moden , Warren M. Farnworth
- Applicant: Larry D. Kinsman , Walter L. Moden , Warren M. Farnworth
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: TraskBritt
- Main IPC: H01L21/00
- IPC: H01L21/00
Abstract:
A method for securing a semiconductor device to a carrier substrate includes inserting a semiconductor device with a plurality of stub contacts extending from a bottom edge thereof into a receptacle of an alignment device associated with the carrier substrate. Upon attachment of the alignment device to a carrier substrate and insertion of a vertically mountable semiconductor device into the receptacle, the semiconductor device is biased so as to establish and maintain electrical communication between the semiconductor device and the carrier substrate.
Public/Granted literature
- US20060030072A1 Methods for securing packaged semiconductor devices to carrier substrates Public/Granted day:2006-02-09
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