Invention Grant
US07569418B2 Methods for securing packaged semiconductor devices to carrier substrates 失效
将封装的半导体器件固定到载体衬底的方法

Methods for securing packaged semiconductor devices to carrier substrates
Abstract:
A method for securing a semiconductor device to a carrier substrate includes inserting a semiconductor device with a plurality of stub contacts extending from a bottom edge thereof into a receptacle of an alignment device associated with the carrier substrate. Upon attachment of the alignment device to a carrier substrate and insertion of a vertically mountable semiconductor device into the receptacle, the semiconductor device is biased so as to establish and maintain electrical communication between the semiconductor device and the carrier substrate.
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