公开(公告)号：US08035974B1

公开(公告)日：2011-10-11

申请号：US09152659

申请日：1998-09-14

申请人： David J. Corisis ,  Walter L. Moden ,  Terry R. Lee

发明人： David J. Corisis ,  Walter L. Moden ,  Terry R. Lee

IPC分类号： H05K7/20 ,  H02B1/01

CPC分类号： H05K3/301 ,  H01L25/105 ,  H01L2924/0002 ,  H01L2924/00

摘要： A system for supporting integrated circuit packages to prevent mechanical failure of the packages at their connection to a printed circuit board or card involves bracing the packages to the board or card, The packages may also be braced against one another. The structure is particularly well adapted to supporting vertical surface mount packages at a point spaced from the point where they connect to a printed circuit board or card.

摘要翻译： 一种用于支持集成电路封装以防止封装在其与印刷电路板或卡的连接处的机械故障的系统包括将封装支撑到板或卡上。封装也可以相互支撑。 该结构特别适合于在与连接到印刷电路板或卡的点间隔开的点处支撑垂直表面安装封装。

公开(公告)号：US20100148352A1

公开(公告)日：2010-06-17

申请号：US12714163

申请日：2010-02-26

申请人： Walter L. Moden

发明人： Walter L. Moden

IPC分类号： H01L23/52 ,  H01L23/488

CPC分类号： H01L24/81 ,  H01L21/485 ,  H01L21/563 ,  H01L23/13 ,  H01L23/3107 ,  H01L23/3128 ,  H01L23/4951 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/5382 ,  H01L24/06 ,  H01L24/48 ,  H01L24/49 ,  H01L24/75 ,  H01L24/85 ,  H01L25/0655 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/06136 ,  H01L2224/16 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48465 ,  H01L2224/49175 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/75 ,  H01L2224/81801 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2224/85207 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01076 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/19107 ,  H05K1/141 ,  H05K3/305 ,  H05K3/328 ,  H05K3/3436 ,  H05K3/368 ,  H05K2201/049 ,  H05K2201/10477 ,  H05K2201/10727 ,  H05K2203/0415 ,  H05K2203/049 ,  Y02P70/613 ,  H01L2224/78 ,  H01L2224/45099 ,  H01L2924/00

摘要： A semiconductor device assembly includes a substrate and a semiconductor die adjacent to a first surface of the substrate. The substrate also includes a second surface opposite from the first surface, an opening extending from the first surface and the second surface, contact pads on the second surface, and substrate pads on the second surface, adjacent to the opening. Bond pads of the semiconductor die are aligned with the opening through the substrate. Intermediate conductive elements, such as bond wires, extend from bond pads of the semiconductor die, through the opening, to substrate pads on the opposite, second surface of the substrate. An encapsulant, which fills the opening and covers the intermediate conductive elements, protrudes beyond a plane in which the second surface of the substrate is located. Discrete conductive elements, such as solder balls, may protrude from the contact pads of the substrate to connect the semiconductor device assembly to another component, such as a printed circuit board or another packaged semiconductor device.

摘要翻译： 半导体器件组件包括与衬底的第一表面相邻的衬底和半导体管芯。 衬底还包括与第一表面相对的第二表面，从第一表面和第二表面延伸的开口，第二表面上的接触焊盘以及与开口相邻的第二表面上的衬底焊盘。 半导体管芯的焊盘与通过衬底的开口对准。 诸如接合线的中间导电元件从半导体管芯的接合焊盘延伸通过开口，延伸到衬底的相对的第二表面上的衬底焊盘。 填充开口并覆盖中间导电元件的密封剂突出超过衬底的第二表面所在的平面。 离散导电元件（例如焊球）可以从衬底的接触焊盘突出，以将半导体器件组件连接到另一部件，例如印刷电路板或另一个封装的半导体器件。

公开(公告)号：US07569418B2

公开(公告)日：2009-08-04

申请号：US11219214

申请日：2005-09-01

申请人： Larry D. Kinsman ,  Walter L. Moden ,  Warren M. Farnworth

发明人： Larry D. Kinsman ,  Walter L. Moden ,  Warren M. Farnworth

IPC分类号： H01L21/00

CPC分类号： H05K3/301 ,  H01L25/105 ,  H01L2225/107 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/3011 ,  H05K2201/10454 ,  H05K2201/10696 ,  Y10S83/942 ,  Y10T29/49121 ,  Y10T29/4913 ,  Y10T29/49135 ,  Y10T29/49147 ,  Y10T29/49156 ,  Y10T29/49169 ,  Y10T29/53174 ,  Y10T29/53178 ,  H01L2924/00

摘要： A method for securing a semiconductor device to a carrier substrate includes inserting a semiconductor device with a plurality of stub contacts extending from a bottom edge thereof into a receptacle of an alignment device associated with the carrier substrate. Upon attachment of the alignment device to a carrier substrate and insertion of a vertically mountable semiconductor device into the receptacle, the semiconductor device is biased so as to establish and maintain electrical communication between the semiconductor device and the carrier substrate.

摘要翻译： 一种用于将半导体器件固定到载体衬底的方法包括：将半导体器件从其底部边缘延伸到与载体衬底相关联的对准器件的插座中插入多个短截线。 在将对准装置附接到载体基板并将可垂直安装的半导体装置插入到插座中时，半导体器件被偏置以便建立并维持半导体器件和载体衬底之间的电连通。

公开(公告)号：US07381591B2

公开(公告)日：2008-06-03

申请号：US11437550

申请日：2006-05-19

申请人： Walter L. Moden

发明人： Walter L. Moden

IPC分类号： H01L21/00

CPC分类号： H01L24/81 ,  H01L21/485 ,  H01L21/563 ,  H01L23/13 ,  H01L23/3107 ,  H01L23/3128 ,  H01L23/4951 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/5382 ,  H01L24/06 ,  H01L24/48 ,  H01L24/49 ,  H01L24/75 ,  H01L24/85 ,  H01L25/0655 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/06136 ,  H01L2224/16 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48465 ,  H01L2224/49175 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/75 ,  H01L2224/81801 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2224/85207 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01076 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/19107 ,  H05K1/141 ,  H05K3/305 ,  H05K3/328 ,  H05K3/3436 ,  H05K3/368 ,  H05K2201/049 ,  H05K2201/10477 ,  H05K2201/10727 ,  H05K2203/0415 ,  H05K2203/049 ,  Y02P70/613 ,  H01L2224/78 ,  H01L2224/45099 ,  H01L2924/00

摘要： A board for connecting a bare semiconductor die with a bond pad arrangement which does not conform to a master printed circuit board with a specific or standardized pin out, connector pad, or lead placement arrangement. The board comprises a printed circuit board including first elements, such as minute solder balls, pins, or bond wires, for making electrical contact between the board and the master board, and second elements, such as minute solder balls, pins, or bond wires, for making electrical contact between the semiconductor die and the board. The board has circuit traces for electrical communication between the board/master board electrical contact elements, and the semiconductor die board electrical contact elements.

公开(公告)号：US07329945B2

公开(公告)日：2008-02-12

申请号：US11070364

申请日：2005-03-01

申请人： Walter L. Moden

发明人： Walter L. Moden

IPC分类号： H01L23/48

CPC分类号： H01L24/81 ,  H01L21/485 ,  H01L21/563 ,  H01L23/13 ,  H01L23/3107 ,  H01L23/3128 ,  H01L23/4951 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/5382 ,  H01L24/06 ,  H01L24/48 ,  H01L24/49 ,  H01L24/75 ,  H01L24/85 ,  H01L25/0655 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/06136 ,  H01L2224/16 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48465 ,  H01L2224/49175 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/75 ,  H01L2224/81801 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2224/85207 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01076 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/19107 ,  H05K1/141 ,  H05K3/305 ,  H05K3/328 ,  H05K3/3436 ,  H05K3/368 ,  H05K2201/049 ,  H05K2201/10477 ,  H05K2201/10727 ,  H05K2203/0415 ,  H05K2203/049 ,  Y02P70/613 ,  H01L2224/78 ,  H01L2224/45099 ,  H01L2924/00

摘要： A board for connecting a bare semiconductor die with a bond pad arrangement which does not conform to a master printed circuit board with a specific or standardized pin out, connector pad, or lead placement arrangement. The board comprises a printed circuit board including first elements, such as minute solder balls, pins, or bond wires, for making electrical contact between the board and the master board, and second elements, such as minute solder balls, pins, or bond wires, for making electrical contact between the semiconductor die and the board. The board has circuit traces for electrical communication between the board/master board electrical contact elements, and the semiconductor die board electrical contact elements.

摘要翻译： 用于将裸半导体管芯与不符合具有特定或标准的引脚输出，连接器焊盘或引线放置布置的主印刷电路板的接合焊盘装置连接的板。 板包括印刷电路板，其包括第一元件，例如用于在基板和母板之间进行电接触的微小焊球，引脚或接合线，以及第二元件，例如微小的焊球，引脚或接合线 用于在半导体管芯和电路板之间进行电接触。 电路板具有用于电路板/主板电接触元件之间的电气通信的电路迹线以及半导体裸片板电接触元件。

公开(公告)号：US07087116B2

公开(公告)日：2006-08-08

申请号：US10361240

申请日：2003-02-10

申请人： Walter L. Moden ,  Syed S. Ahmad ,  Gregory M. Chapman ,  Tongbi Jiang

发明人： Walter L. Moden ,  Syed S. Ahmad ,  Gregory M. Chapman ,  Tongbi Jiang

IPC分类号： B05C3/00

CPC分类号： H01L24/06 ,  H01L21/67132 ,  H01L23/4951 ,  H01L24/27 ,  H01L24/45 ,  H01L24/48 ,  H01L24/743 ,  H01L2224/04042 ,  H01L2224/05599 ,  H01L2224/06136 ,  H01L2224/32245 ,  H01L2224/45014 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/73215 ,  H01L2224/83192 ,  H01L2224/83856 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/00015 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method and apparatus for achieving a level exposed surface of a viscous material pool for applying viscous material to at least one semiconductor component by contacting at least a portion of the semiconductor component with viscous material within a reservoir. A level viscous material exposed surface is achieved by using at least one mechanism in association with the reservoir. The mechanism is configured to level the exposed surface of viscous material and maintain the exposed surface at a substantially constant level. The reservoir may be shaped such that the exposed surface of viscous material is supplied to a precise location.

公开(公告)号：US06865086B2

公开(公告)日：2005-03-08

申请号：US10191139

申请日：2002-07-09

申请人： Derek J. Gochnour ,  Walter L. Moden ,  Michael W. Morrison

发明人： Derek J. Gochnour ,  Walter L. Moden ,  Michael W. Morrison

IPC分类号： H01R31/06 ,  H05K5/02

CPC分类号： G06K19/07739 ,  H01R12/721 ,  H01R31/06

摘要： An apparatus and method of removably interconnecting a reduced-sized memory card with an extension member. The locking mechanism may be formed in a peripheral end portion of the reduced-sized memory card that may include an entry surface and a ledge. The extension member may include a biasing portion that slidably engages the entry surface and removable interconnects with the ledge. With this arrangement, the extension member may easily be secured and removed from the reduced-sized memory card, allowing easy interchangeability between a standard-sized socket of one electronic device and a reduced-sized socket of another electronic device.

摘要翻译： 一种可拆卸地将小型存储卡与扩展构件互连的装置和方法。 锁定机构可以形成在缩小尺寸的存储卡的外围端部，其可以包括入口表面和凸缘。 延伸构件可以包括可滑动地接合进入表面的偏置部分和与凸缘的可移除的互连。 通过这种布置，扩展构件可以容易地从减小尺寸的存储卡中被固定和移除，从而允许一个电子设备的标准尺寸的插座与另一个电子设备的小型插座之间的容易的互换性。

公开(公告)号：US06828173B2

公开(公告)日：2004-12-07

申请号：US10132429

申请日：2002-04-25

申请人： Warren M. Farnworth ,  Larry D. Kinsman ,  Walter L. Moden

发明人： Warren M. Farnworth ,  Larry D. Kinsman ,  Walter L. Moden

IPC分类号： H01L2144

CPC分类号： H01L24/11 ,  H01L23/485 ,  H01L24/02 ,  H01L24/45 ,  H01L2224/02371 ,  H01L2224/0401 ,  H01L2224/13099 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/15787 ,  H01L2924/3011 ,  H01L2224/48 ,  H01L2924/00

摘要： A vertically mountable semiconductor device including at least one bond pad disposed on an edge thereof. The bond pad includes a conductive bump disposed thereon. The semiconductor device may also include a protective overcoat layer. The present invention also includes a method of fabricating the semiconductor device, including forming disconnected notches in a semiconductor wafer, redirecting circuit traces into each of the notches, and singulating the semiconductor wafer along the notches to form bond pads on the edges of the resultant semiconductor devices. A method of attaching the semiconductor device to a carrier substrate includes orienting the semiconductor device such that the bond pad is aligned with a corresponding terminal of the carrier substrate and establishing an electrical connection between the bond pad and the terminal. Preferably, an electrically conductive material is disposed between the bond pad and the terminal to establish an electrically conductive bond between the semiconductor device and the carrier substrate.

摘要翻译： 一种垂直安装的半导体器件，包括设置在其边缘上的至少一个接合焊盘。 接合焊盘包括设置在其上的导电凸块。 半导体器件还可以包括保护性外涂层。 本发明还包括一种制造半导体器件的方法，包括在半导体晶片中形成断开的凹口，将电路迹线重定向到每个凹口中，以及沿着凹口划分半导体晶片，以在所得半导体的边缘上形成接合焊盘 设备。 将半导体器件附接到载体衬底的方法包括使半导体器件定向，使得接合焊盘与载体衬底的相应端子对准并且在接合焊盘和端子之间建立电连接。 优选地，导电材料设置在接合焊盘和端子之间，以在半导体器件和载体衬底之间建立导电接合。

公开(公告)号：US06818460B2

公开(公告)日：2004-11-16

申请号：US09942323

申请日：2001-08-29

申请人： Walter L. Moden ,  Syed S. Ahmad ,  Gregory M. Chapman ,  Tongbi Jiang

发明人： Walter L. Moden ,  Syed S. Ahmad ,  Gregory M. Chapman ,  Tongbi Jiang

IPC分类号： G01R3126

CPC分类号： H01L24/27 ,  H01L23/4951 ,  H01L24/06 ,  H01L24/48 ,  H01L24/49 ,  H01L24/743 ,  H01L24/83 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/06136 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/4826 ,  H01L2224/48472 ,  H01L2224/49175 ,  H01L2224/73215 ,  H01L2224/743 ,  H01L2224/7565 ,  H01L2224/83194 ,  H01L2224/8385 ,  H01L2224/85399 ,  H01L2224/92147 ,  H01L2924/00014 ,  H01L2924/00015 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method for applying a viscous material to a lead frame element. A method of the invention includes positioning the lead frame facing downward and bringing the lead fingers into contact with a pool of adhesive material. The contact of the lead fingers to the adhesive material results in a portion of the lead fingers receiving a portion of the adhesive material from the pool of adhesive material. The gravitational forces on the adhesive material on the downward facing lead frame maintain the shape and boundary definition of the adhesive material.

摘要翻译： 一种将粘性材料施加到引线框架元件的方法。 本发明的一种方法包括将引线框架朝下定位并使引线指与一块粘合剂材料接触。 引线指与粘合剂材料的接触导致引线指的一部分从粘合剂材料池接收粘合材料的一部分。 面向下的引线框架上的粘合剂材料上的重力保持粘合剂材料的形状和边界限定。

公开(公告)号：US06684493B2

公开(公告)日：2004-02-03

申请号：US10099483

申请日：2002-03-13

申请人： Larry D. Kinsman ,  Walter L. Moden ,  Warren M. Farnworth

发明人： Larry D. Kinsman ,  Walter L. Moden ,  Warren M. Farnworth

IPC分类号： H05K336

CPC分类号： H05K3/301 ,  H01L23/32 ,  H01L25/105 ,  H01L2225/1023 ,  H01L2225/1064 ,  H01L2225/107 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/3011 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49169 ,  H01L2924/00

摘要： A support assembly for mounting a semiconductor device vertically relative to a carrier substrate is disclosed. The support assembly includes an interposer to which the semiconductor device is attached. The support assembly also includes traces carried on the interposer, which electronically connect the semiconductor device to contacts on the interposer. The contacts are disposed along a single edge of the interposer. The invention also includes an alignment device for releaseably mounting the support assembly. The alignment device, which mounts to a carrier substrate, includes one or more receptacles. As a support assembly is inserted into a receptacle, the alignment device establishes an electrical connection between the contacts and corresponding terminals on the carrier substrate. The assembly may also include a cover that attaches to the top of the alignment device and biases the interposer against the carrier substrate.

摘要翻译： 公开了一种用于相对于载体衬底垂直安装半导体器件的支撑组件。 支撑组件包括插入件，半导体器件附接到该插入器。 支撑组件还包括承载在插入器上的迹线，其将半导体器件电连接到插入器上的触点。 触点沿着插入器的单个边缘设置。 本发明还包括用于可释放地安装支撑组件的对准装置。 安装到载体基板的对准装置包括一个或多个插座。 当支撑组件插入到插座中时，对准装置在触点和载体基板上的相应端子之间建立电连接。 组件还可以包括附接到对准装置的顶部并将插入件偏压抵靠载体基板的盖。