Invention Grant
- Patent Title: Sound detecting mechanism
- Patent Title (中): 声音检测机构
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Application No.: US10565059Application Date: 2004-07-14
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Publication No.: US07570773B2Publication Date: 2009-08-04
- Inventor: Yoshiaki Ohbayashi , Mamoru Yasuda , Shinichi Saeki , Masatsugu Komai , Kenichi Kagawa
- Applicant: Yoshiaki Ohbayashi , Mamoru Yasuda , Shinichi Saeki , Masatsugu Komai , Kenichi Kagawa
- Applicant Address: JP Osaka JP Tokyo
- Assignee: Hosiden Corporation,Tokyo Electron Limited
- Current Assignee: Hosiden Corporation,Tokyo Electron Limited
- Current Assignee Address: JP Osaka JP Tokyo
- Agency: The Webb Law Firm
- Priority: JP2003-276009 20030717
- International Application: PCT/JP2004/010042 WO 20040714
- International Announcement: WO2005/009077 WO 20050127
- Main IPC: H04R25/00
- IPC: H04R25/00

Abstract:
A sound detecting mechanism capable of forming a diaphragm and a back electrode on a substrate by a simple process includes acoustic holes corresponding to perforations formed on a front surface of a substrate. A second protective film, a sacrificial layer and a metal film are laminated on the front surface in a portion corresponding to the acoustic holes. The substrate is etched from the back surface thereof to a depth reaching the acoustic holes to form an acoustic opening. Subsequently, by effecting an etching from the back surface of the substrate through the acoustic holes, the sacrificial layer is removed and a void area is formed between the diaphragm made of the metal film, the substrate and the formed perforations. The sacrificial layer that remains after the etching is used as a spacer for maintaining a gap between the back electrode and the diaphragm.
Public/Granted literature
- US20060233400A1 Sound detecting mechanism Public/Granted day:2006-10-19
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