发明授权
US07573130B1 Crack trapping and arrest in thin film structures 失效
在薄膜结构中破裂捕获和捕获

Crack trapping and arrest in thin film structures
摘要:
The present invention relates to a process for preparing a robust crack-absorbing integrated circuit chip comprising a crack trapping structure containing two metal plates and a via-bar structure sandwiched between said plates.
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