公开(公告)号：US20240314974A1

公开(公告)日：2024-09-19

申请号：US18675691

申请日：2024-05-28

申请人： SLICIP, Inc.

发明人： Gary D. Testa ,  Dmitry Fomin

IPC分类号： H05K7/20 ,  G06F1/20 ,  H01L23/44

CPC分类号： H05K7/20272 ,  H05K7/20236 ,  G06F1/20 ,  H01L23/44

摘要： An immersion-cooling container for single-phase liquid dielectric immersion cooling. The container has a tank and a liner, which mate together to form a sealed inflow channel and one or more sealed outflow channels. The liner and the support base comprise one or more vents to permit passage of dielectric liquid to envelop and cool equipment disposed inside the container. The liner sidewalls define one or more flow channels that promote passage of the liquid coolant from the container and into the outflow channels, thereby enabling continuous circulation of the dielectric liquid.

公开(公告)号：US12050061B2

公开(公告)日：2024-07-30

申请号：US17546261

申请日：2021-12-09

申请人： Aavid Thermalloy, LLC

发明人： Sukhvinder S. Kang

IPC分类号： H01L23/373 ,  F28D1/02 ,  F28D15/02 ,  F28F3/06 ,  H01L23/44 ,  H05K7/20 ,  F28D21/00 ,  H01L23/427

CPC分类号： F28D1/0226 ,  F28D1/0206 ,  F28D15/02 ,  F28F3/06 ,  H01L23/3733 ,  H01L23/44 ,  H05K7/203 ,  F28D2001/0286 ,  F28D2021/0028 ,  H01L23/427 ,  H05K7/20309

摘要： A heat sink for use in an immersion cooling system that includes a sintered powder structure enclosed in a porous enclosure. The porous enclosure has openings, e.g., formed by a mesh, with a size to help contain sintered powder particles that may be dislodged during operation of the heat sink.

公开(公告)号：US20240087985A1

公开(公告)日：2024-03-14

申请号：US17944945

申请日：2022-09-14

申请人： US Hybrid Corporation

发明人： Alex Nguyen ,  Gordon Abas Goodarzi

IPC分类号： H01L23/44 ,  H01L23/473

CPC分类号： H01L23/44 ,  H01L23/473

摘要： Disclosed is a dual-sided cooling jacket configured to receive and cool devices on both sides of the cooling jacket. The cooling jacket may include a main fluid chamber that receives and outputs fluid from an inlet and an outlet, respectively. A first plate and a second plate may be joined to form the cooling jacket with the main fluid chamber therebetween. The first plate may include first threaded members that allow one or more devices to be mounted to the first plate. The second plate may include second threaded members that allow devices to be mounted to the second plate. The cooling jacket may include a siphon line to prevent accumulation of air bubbles within the main fluid chamber. Other examples may be described and claimed.

公开(公告)号：US11917793B2

公开(公告)日：2024-02-27

申请号：US17145816

申请日：2021-01-11

申请人： CISCO TECHNOLOGY, INC.

发明人： Mark Nowell ,  M. Baris Dogruoz ,  Mandy Hin Lam ,  Rakesh Chopra

IPC分类号： H05K7/20 ,  G06F1/20 ,  H01L23/44

CPC分类号： H05K7/20236 ,  G06F1/20 ,  H01L23/44

摘要： In one embodiment, an apparatus is configured for insertion into a network device and includes a printed circuit board, at least one electronic component mounted on the printed circuit board and configured for direct air-cooling, and an enclosure comprising a plurality of electronic components, an electrical connector, a fluid inlet connector, and a fluid outlet connector. A dielectric liquid is disposed within the enclosure for immersion cooling of said plurality of electronic components during operation of the network device.

公开(公告)号：US20230395463A1

公开(公告)日：2023-12-07

申请号：US18454703

申请日：2023-08-23

申请人： Micron Technology, Inc.

发明人： Sameer S. Vadhavkar ,  Xiao Li ,  Steven K. Groothuis ,  Jian Li ,  Jaspreet S. Gandhi ,  James M. Derderian ,  David R. Hembree

IPC分类号： H01L23/44 ,  H01L25/00 ,  H01L21/56 ,  H01L23/00 ,  H01L23/367 ,  H01L25/18 ,  H01L23/04 ,  H01L21/50 ,  H01L25/065 ,  H01L23/373 ,  H01L21/52 ,  H01L21/54 ,  H01L23/053 ,  H01L23/31

CPC分类号： H01L23/44 ,  H01L25/50 ,  H01L21/563 ,  H01L24/83 ,  H01L23/3675 ,  H01L25/18 ,  H01L23/04 ,  H01L21/50 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/32 ,  H01L24/92 ,  H01L25/0657 ,  H01L23/3736 ,  H01L24/73 ,  H01L21/52 ,  H01L21/54 ,  H01L23/053 ,  H01L23/3128 ,  H01L2924/156 ,  H01L2924/1815 ,  H01L2224/1703 ,  H01L2224/32145 ,  H01L2224/73203 ,  H01L2224/73253 ,  H01L2225/06517 ,  H01L2225/06589 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/16235 ,  H01L2924/16251 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2224/17519 ,  H01L2224/2939 ,  H01L24/29 ,  H01L24/33 ,  H01L2224/1134 ,  H01L2224/13025 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/133 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2224/16227 ,  H01L2224/17181 ,  H01L2224/2919 ,  H01L2224/29191 ,  H01L2224/2929 ,  H01L2224/29393 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/83101 ,  H01L2224/83102 ,  H01L2224/83424 ,  H01L2224/83447 ,  H01L2224/8388 ,  H01L2224/92125 ,  H01L2924/15311 ,  H01L2224/83104 ,  H01L2224/1329

摘要： Method for packaging a semiconductor die assemblies. In one embodiment, a method is directed to packaging a semiconductor die assembly having a first die and a plurality of second dies arranged in a stack over the first die, wherein the first die has a peripheral region extending laterally outward from the stack of second dies. The method can comprise coupling a thermal transfer structure to the peripheral region of the first die and flowing an underfill material between the second dies. The underfill material is flowed after coupling the thermal transfer structure to the peripheral region of the first die such that the thermal transfer structure limits lateral flow of the underfill material.

公开(公告)号：US20230245949A1

公开(公告)日：2023-08-03

申请号：US17898410

申请日：2022-08-29

申请人： InnoLux Corporation

发明人： Chin-Lung TING ,  Chung-Kuang WEI ,  Cheng-Chi WANG ,  Yeong-E CHEN ,  Yi-Hung LIN

IPC分类号： H01L23/44 ,  H05K1/02 ,  H01L25/065 ,  H01L23/498 ,  H01L25/075 ,  H01L23/00

CPC分类号： H01L23/44 ,  H05K1/0209 ,  H01L25/0655 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49833 ,  H01L23/49838 ,  H01L25/0753 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2924/12041 ,  H01L2224/32225 ,  H01L2224/73204 ,  H05K2201/064

摘要： An electronic device is disclosed. The electronic device includes a circuit layer, an electronic element and a thermal conducting element. The electronic element is disposed on the circuit layer and electrically connected to the circuit layer. The thermal conducting element is disposed between the circuit layer and the electronic element. The thermal conducting element is used for performing heat exchange with the electronic element.

公开(公告)号：US20230215779A1

公开(公告)日：2023-07-06

申请号：US17813417

申请日：2022-07-19

申请人： SAMSUNG ELECTRONICS CO., LTD.

发明人： Hyunggyun NOH ,  Sangwoo PAE ,  Jinsoo BAE

IPC分类号： H01L23/44 ,  H01L23/473 ,  H01L25/07 ,  H05K7/20

CPC分类号： H01L23/44 ,  H01L23/473 ,  H01L25/072 ,  H05K7/203

摘要： Disclosed is a semiconductor module comprising a module substrate having a top surface and a bottom surface that are opposite to each other, a plurality of semiconductor packages on the top surface of the module substrate and arranged in a first direction parallel to the top surface of the module substrate, and a clip structure on the top surface of the module substrate and spaced apart from the plurality of semiconductor packages in the first direction. The clip structure includes a body part on the top surface of the module substrate and spaced apart from the plurality of semiconductor packages in the first direction, and a connection part that extends from the body part across a lateral surface of the module substrate onto the bottom surface of the module substrate.

公开(公告)号：US20230125822A1

公开(公告)日：2023-04-27

申请号：US17512138

申请日：2021-10-27

申请人： Intel Corporation

发明人： Abdulafeez Adebiyi ,  Je-Young Chang ,  Devdatta Kulkarni

IPC分类号： H01L23/44 ,  H01L23/373

摘要： A two-phase immersion cooling system for integrated circuit assembly may be formed utilizing a heat dissipation device thermally coupled to at least one integrated circuit device, wherein the heat dissipation device may include a surface enhancement structure and a boiling enhancement material layer, such as a micro-porous material, on the surface enhancement structure.

公开(公告)号：US20230019930A1

公开(公告)日：2023-01-19

申请号：US17806961

申请日：2022-06-15

申请人： SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

发明人： Inpil YOO ,  Jerome TEYSSEYRE ,  Oseob JEON ,  Keunhyuk LEE ,  Michael J. SEDDON

IPC分类号： H01L23/44 ,  H05K7/20

摘要： Implementations of a semiconductor package may include one or more power semiconductor die included in a die module; a first heat sink directly coupled to one or more source pads of the die module; a second heat sink directly coupled to one or more drain pads of the die module; a gate contact coupled with one or more gate pads of the die module; and a coating coupled directly to the die module. The gate contact may be configured to extend through an immersion cooling enclosure.

公开(公告)号：US11412636B2

公开(公告)日：2022-08-09

申请号：US17146517

申请日：2021-01-12

申请人： Cooler Master Co., Ltd.

发明人： Sy chi Kuo ,  Yu lun Huang

IPC分类号： H05K7/20 ,  H01L23/44 ,  H01L23/473 ,  F28D1/02

摘要： A single-phase immersion cooling system, comprising a fluid-tight containment vessel, dielectric thermally conductive fluid, at least a heat-generating electronic device, and heat exchanger system is provided. The heat exchanger system comprises a pump, heat exchanger, at least a first conduit, and at least a second conduit. The at least a first and second conduits have first and second modifiable portions comprising first and second openings submerged within the dielectric thermally conductive fluid, respectively. The at least one of the first conduit or second conduit circulates dielectric thermally conductive fluid from a heat exchanger outlet into the fluid-tight containment vessel and the other, circulates dielectric thermally conductive fluid from the fluid-tight containment vessel to a heat exchanger inlet via the pump. The first and second openings are disposed near to greatest opposing ends of the dielectric thermally conductive fluid contained within the fluid-tight containment vessel.