发明授权
- 专利标题： Cleaning substrate of substrate processing equipment and heat resistant resin preferable therefor
- 专利标题（中）： 基板处理设备的清洁基板和耐热树脂是优选的
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申请号： US11252800申请日： 2005-10-19
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公开(公告)号： US07575812B2公开(公告)日： 2009-08-18
- 发明人: Yoshio Terada , Hirofumi Fujii , Makoto Namikawa , Daisuke Uenda , Yasuhiro Amano
- 申请人： Yoshio Terada , Hirofumi Fujii , Makoto Namikawa , Daisuke Uenda , Yasuhiro Amano
- 申请人地址： JP Osaka
- 专利权人： Nitto Denko Corporation
- 当前专利权人： Nitto Denko Corporation
- 当前专利权人地址： JP Osaka
- 代理机构： Sughrue Mion, PLLC
- 优先权： JPP.2004-304027 20041019; JPP.2005-297735 20051012
- 主分类号： B32B27/06
- IPC分类号： B32B27/06 ; B32B7/12 ; B08B7/00
摘要：
The present invention provides a cleaning substrate of a substrate processing equipment, which comprises a cleaning layer comprising a heat resistant resin with a storage modulus (1 Hz) at 20° C. up to 150° C. being 5×107 Pa to 1×109 Pa on at least one face of the substrate; and a polyimide resin suitable as the heat resistant resin for the cleaning layer and usable under circumstances possibly involving the generation of serious disadvantages due to silicone contamination, such as for HDD application and some semiconductor applications.
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