发明授权
- 专利标题: Semiconductor apparatus and process for fabricating the same
- 专利标题(中): 半导体装置及其制造方法
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申请号: US11241177申请日: 2005-09-30
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公开(公告)号: US07579223B2公开(公告)日: 2009-08-25
- 发明人: Masaru Wada , Shinichiro Kondo , Ryouichi Yasuda
- 申请人: Masaru Wada , Shinichiro Kondo , Ryouichi Yasuda
- 申请人地址: JP Tokyo
- 专利权人: Sony Corporation
- 当前专利权人: Sony Corporation
- 当前专利权人地址: JP Tokyo
- 代理机构: K&L Gates LLP
- 主分类号: H01L21/00
- IPC分类号: H01L21/00
摘要:
A semiconductor apparatus in which a conducting path formed from organic semiconductor molecules as a material has a novel structure and exhibits high mobility, and a manufacturing method for fabricating the same are provided. Fine particles that include a conductor or a semiconductor and organic semiconductor molecules, are alternately bonded through a functional group at both terminals of the organic semiconductor molecules to form a conducting path in a network form such that the conducting path in the fine particles and the conducting path in the organic semiconductor molecules are two-dimensionally or three-dimensionally linked together. This conducting path includes no intermolecular electron transfer, and the mobility is not restricted by the intermolecular electron transfer, and therefore the mobility of the conducting path along the main chain in the organic semiconductor molecules (in the direction of the axis of the molecule), for example, displays a high intramolecular mobility due to delocalized π electrons can be fully utilized.
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