发明授权
- 专利标题: Nanostructured dielectric composite materials
- 专利标题(中): 纳米结构介电复合材料
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申请号: US11044489申请日: 2005-01-27
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公开(公告)号: US07579397B2公开(公告)日: 2009-08-25
- 发明人: John Keith Nelson , Walter Zenger , Robert John Keefe , Linda Sue Schadler Feist
- 申请人: John Keith Nelson , Walter Zenger , Robert John Keefe , Linda Sue Schadler Feist
- 申请人地址: US NY Troy
- 专利权人: Rensselaer Polytechnic Institute
- 当前专利权人: Rensselaer Polytechnic Institute
- 当前专利权人地址: US NY Troy
- 代理机构: Curatolo Sidoti Co., LPA
- 代理商 Joseph G. Curatolo; Peter R. Detorre
- 主分类号: C08K3/10
- IPC分类号: C08K3/10 ; C08K3/04 ; C08K3/26 ; C08K7/02 ; H01B3/30
摘要:
A nanocomposite material suitable for electrical insulation includes a polymer compounded with a substantially homogeneously distributed functionalized nanoparticle filler. The nanocomposite material is produced by compounding the polymer with the functionalized nanoparticle filler by imparting a shear force to a mixture of the polymer and filler capable of preventing agglomeration of the filler whereby the filler is substantially homogeneously distributed in the nanocomposite material. The electrical insulation may be adapted for AC or DC high voltage, and may also be adapted for low or medium voltage to prevent formation of water tree structures.
公开/授权文献
- US20060167139A1 Nanostructured dielectric composite materials 公开/授权日:2006-07-27
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