Invention Grant
- Patent Title: Flip-chip type assembly
- Patent Title (中): 倒装片式组装
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Application No.: US11545674Application Date: 2006-10-11
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Publication No.: US07582973B2Publication Date: 2009-09-01
- Inventor: Hiroyuki Hamaguchi
- Applicant: Hiroyuki Hamaguchi
- Applicant Address: JP Tokyo
- Assignee: NEC Corporation
- Current Assignee: NEC Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2005-297657 20051012
- Main IPC: H01L23/14
- IPC: H01L23/14

Abstract:
A structure for sufficiently alleviating the thermal stress between an LSI and substrate and allowing the LSI to be detached from a substrate easily is provided. In a flip-chip type assembly according to the present invention, an interposer made of silicon intervenes between the device and the substrate. The LSI and the interposer are connected with a solder and, the interposer and the substrate are connected with a conductive resin. The conductive resin alleviates the thermal stress between the substrate and the interposer. The LSI can be detached easily by heating the solder. The thermal stress between the LSI and the interposer can be reduced because both of them are made of silicon.
Public/Granted literature
- US20070080454A1 Flip-chip type assembly Public/Granted day:2007-04-12
Information query
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