- 专利标题： Semiconductor package board using a metal base
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申请号： US11477111申请日： 2006-06-29
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公开(公告)号： US07585699B2公开(公告)日： 2009-09-08
- 发明人: Katsumi Kikuchi , Tadanori Shimoto , Koji Matsui , Kazuhiro Baba
- 申请人： Katsumi Kikuchi , Tadanori Shimoto , Koji Matsui , Kazuhiro Baba
- 申请人地址： JP Tokyo
- 专利权人： NEC Corporation
- 当前专利权人： NEC Corporation
- 当前专利权人地址： JP Tokyo
- 代理机构： Sughrue Mion, PLLC
- 优先权： JP2000-199634 20000630
- 主分类号： H01L21/44
- IPC分类号： H01L21/44 ; H01L21/48 ; H01L21/50
摘要：
A semiconductor package board for mounting thereon a semiconductor chip includes a metal base having an opening for receiving therein the semiconductor chip and a multilayer wiring film layered onto the metal base. The semiconductor chip is flip-chip bonded onto the metal pads disposed on the multilayer wiring film within the opening. The surface of the metal base is flush with the top surface of the semiconductor chip received in the opening. The resultant semiconductor device has a larger number of external pins and a smaller deformation without using a stiffener.
公开/授权文献
- US20060244137A1 Semiconductor package board using a metal base 公开/授权日：2006-11-02
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