Invention Grant
- Patent Title: Method of fabricating a semiconductor device
- Patent Title (中): 制造半导体器件的方法
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Application No.: US11898951Application Date: 2007-09-18
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Publication No.: US07585706B2Publication Date: 2009-09-08
- Inventor: Katsunori Nishii , Kaoru Inoue , Toshinobu Matsuno , Yoshito Ikeda , Hiroyuki Masato
- Applicant: Katsunori Nishii , Kaoru Inoue , Toshinobu Matsuno , Yoshito Ikeda , Hiroyuki Masato
- Applicant Address: JP Osaka
- Assignee: Panasonic Corporation
- Current Assignee: Panasonic Corporation
- Current Assignee Address: JP Osaka
- Agency: Nixon Peabody LLP
- Agent Jeffrey L. Costellia
- Priority: JP2000-080242 20000322
- Main IPC: H01L21/336
- IPC: H01L21/336

Abstract:
The semiconductor device of this invention includes an active region formed from a group III nitride semiconductor grown on a substrate and an insulating oxide film formed in a peripheral portion of the active region by oxidizing the group III nitride semiconductor. On the active region, a gate electrode in Schottky contact with the active region extending onto the insulating oxide film and having an extended portion on the insulating oxide film is formed, and ohmic electrodes respectively serving as a source electrode and a drain electrode are formed with space from side edges along the gate length direction of the gate electrode.
Public/Granted literature
- US20080038856A1 Semiconductor device and method of fabricating the same Public/Granted day:2008-02-14
Information query
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