Method of fabricating a semiconductor device
    1.
    发明授权
    Method of fabricating a semiconductor device 有权
    制造半导体器件的方法

    公开(公告)号:US07585706B2

    公开(公告)日:2009-09-08

    申请号:US11898951

    申请日:2007-09-18

    IPC分类号: H01L21/336

    摘要: The semiconductor device of this invention includes an active region formed from a group III nitride semiconductor grown on a substrate and an insulating oxide film formed in a peripheral portion of the active region by oxidizing the group III nitride semiconductor. On the active region, a gate electrode in Schottky contact with the active region extending onto the insulating oxide film and having an extended portion on the insulating oxide film is formed, and ohmic electrodes respectively serving as a source electrode and a drain electrode are formed with space from side edges along the gate length direction of the gate electrode.

    摘要翻译: 本发明的半导体器件包括由在衬底上生长的III族氮化物半导体形成的有源区和通过氧化III族氮化物半导体而形成在有源区的周边部分中的绝缘氧化物膜。 在有源区域上,形成与延伸到绝缘氧化膜上并在绝缘氧化膜上具有延伸部分的有源区肖特基接触的栅电极,分别用作源电极和漏电极的欧姆电极形成有 沿着栅电极的栅极长度方向的侧边缘的空间。

    Semiconductor device and method of fabricating the same
    2.
    发明申请
    Semiconductor device and method of fabricating the same 有权
    半导体装置及其制造方法

    公开(公告)号:US20080038856A1

    公开(公告)日:2008-02-14

    申请号:US11898951

    申请日:2007-09-18

    摘要: The semiconductor device of this invention includes an active region formed from a group III nitride semiconductor grown on a substrate and an insulating oxide film formed in a peripheral portion of the active region by oxidizing the group III nitride semiconductor. On the active region, a gate electrode in Schottky contact with the active region extending onto the insulating oxide film and having an extended portion on the insulating oxide film is formed, and ohmic electrodes respectively serving as a source electrode and a drain electrode are formed with space from side edges along the gate length direction of the gate electrode.

    摘要翻译: 本发明的半导体器件包括由在衬底上生长的III族氮化物半导体形成的有源区和通过氧化III族氮化物半导体而形成在有源区的周边部分中的绝缘氧化物膜。 在有源区域上,形成与延伸到绝缘氧化膜上并在绝缘氧化膜上具有延伸部分的有源区肖特基接触的栅电极,分别用作源电极和漏电极的欧姆电极形成有 沿着栅电极的栅极长度方向的侧边缘的空间。

    Semiconductor device
    6.
    发明授权
    Semiconductor device 有权
    半导体器件

    公开(公告)号:US06531718B2

    公开(公告)日:2003-03-11

    申请号:US09759401

    申请日:2001-01-12

    IPC分类号: H01L2906

    摘要: A semiconductor device includes: a substrate; a buffer layer including GaN formed on the substrate, wherein surfaces of the buffer layer are c facets of Ga atoms; a separating layer including (InXAl1-X)YGa1-YN (where 0≦X≦1, 0≦Y≦1) formed on the buffer layer, wherein surfaces of the separating layer are c facets of In, Al, or Ga atoms; a channel layer including GaN, InGaN, or a combination of GaN and InGaN formed on the separating layer, wherein surfaces of the channel layer are c facets of Ga or In atoms; and an electron supply layer including AlGaN formed on the channel layer, wherein surfaces of the electron supply layer are c facets of Al or Ga atoms, wherein the AlN composition ratio in the separating layer is smaller than the AlN composition ratio in the electron supply layer.

    摘要翻译: 半导体器件包括:衬底; 包括在衬底上形成的GaN的缓冲层,其中缓冲层的表面是Ga原子的c个面; 形成在缓冲层上的(InXAl1-X)YGa1-YN(其中0 <= X <= 1,0 <= Y <= 1)的分离层,其中分离层的表面是In,Al, 或Ga原子; 包含GaN,InGaN或在分离层上形成的GaN和InGaN的组合的沟道层,其中沟道层的表面是Ga或In原子的c个面; 以及形成在沟道层上的包含AlGaN的电子供给层,其中电子供给层的表面是Al或Ga原子的c个面,其中分离层中的AlN组成比小于电子供给层中的AlN组成比 。