发明授权
US07586096B2 Interface assembly for thermally coupling a data acquisition system to a sensor array
有权
用于将数据采集系统热耦合到传感器阵列的接口组件
- 专利标题: Interface assembly for thermally coupling a data acquisition system to a sensor array
- 专利标题(中): 用于将数据采集系统热耦合到传感器阵列的接口组件
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申请号: US11560873申请日: 2006-11-17
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公开(公告)号: US07586096B2公开(公告)日: 2009-09-08
- 发明人: Oliver Richard Astley , James Wilson Rose , Joe James Lacey , Jonathan David Short , Ashutosh Joshi
- 申请人: Oliver Richard Astley , James Wilson Rose , Joe James Lacey , Jonathan David Short , Ashutosh Joshi
- 申请人地址: US NY Niskayuna
- 专利权人: General Electric Company
- 当前专利权人: General Electric Company
- 当前专利权人地址: US NY Niskayuna
- 代理商 Joseph J. Christian
- 主分类号: G01T1/24
- IPC分类号: G01T1/24
摘要:
An interface assembly for a sensor array is provided. The interface assembly may be made up of an integrated circuit package thermally coupled to the sensor array. The interface assembly may include a temperature control system for controlling the temperature of the sensor array. The temperature control system includes a temperature sensor for sensing a temperature variation of each sensor of the sensor array from an initial temperature beyond a predetermined threshold. A temperature controller is coupled to each temperature sensor and receives an output signal from the temperature sensor upon the sensor temperature variation exceeding the predetermined threshold. A temperature correction device is coupled to each temperature controller and causes the sensor temperature variation to fall within the predetermined threshold upon receiving a control signal from the temperature controller.