摘要:
A scintillator array and method for making the same are provided. The array comprises a bi-layer reflector further comprising a conformal smoothing layer and a mirror layer. The bi-layer reflector does not comprise an intervening reducing agent or adhesion layer and/or comprises aluminum. Further, the mirror layer may be deposited via gas phase metallization, allowing application to tightly confined spaces. A detector array comprising the scintillator array is also provided.
摘要:
A scintillator array and method for making the same are provided. The array comprises a bi-layer reflector further comprising a conformal smoothing layer and a mirror layer. The bi-layer reflector does not comprise an intervening reducing agent or adhesion layer and/or comprises aluminum. Further, the mirror layer may be deposited via gas phase metallization, allowing application to tightly confined spaces. A detector array comprising the scintillator array is also provided.
摘要:
An energy-sensitive computed tomography system is provided. The energy-sensitive computed tomography system includes an X-ray source configured to emit an X-ray beam resulting from electrons impinging upon a target material. The energy-sensitive computed tomography system also includes an object positioned within the X-ray beam. The energy-sensitive computed tomography system further includes a detector configured to receive a transmitted beam of the X-rays through the object. The energy-sensitive computed tomography system also includes a filter having an alternating pattern disposed between the X-ray source and the detector, the filter configured to facilitate measuring projection data that can be used to generate low-energy and high-energy spectral information.
摘要:
A method for forming a sensor stack is presented. The method includes providing a substrate having a first side and a second side. Furthermore, the method includes disposing an integrated circuit having a first side and a second side on the first side of the substrate, where the integrated circuit comprises a first plurality of contact pads disposed on the first side of the integrated circuit. The method also includes providing a sensor array having a plurality of sensor elements, wherein each of the sensor elements has a first side and a second side, and wherein the sensor array comprises a second plurality of contact pads disposed on the second side of the sensor array. Furthermore, the method includes disposing an interposer having one or more interposer elements and one or more through vias disposed therethrough between the one or more sensor elements of the sensor array and the integrated circuit to raise the sensor array away from the first side of the integrated circuit such that a plane of the one or more sensor elements is locally normal to a sensor stack normal, wherein the interposer is configured to operationally couple the second side of the sensor elements in the sensor array to the first side of the integrated circuit. In addition, the method includes operationally coupling the first plurality of contact pads on the first side of the integrated circuit to a second plurality of contact pads on the second side of the sensor array to form a tileable sensor stack.
摘要:
A method for forming a sensor stack is presented. The method includes providing a substrate having a first side and a second side. Furthermore, the method includes disposing an integrated circuit having a first side and a second side on the first side of the substrate, where the integrated circuit comprises a first plurality of contact pads disposed on the first side of the integrated circuit. The method also includes providing a sensor array having a plurality of sensor elements, wherein each of the sensor elements has a first side and a second side, and wherein the sensor array comprises a second plurality of contact pads disposed on the second side of the sensor array. Furthermore, the method includes disposing an interposer having one or more interposer elements and one or more through vias disposed therethrough between the one or more sensor elements of the sensor array and the integrated circuit to raise the sensor array away from the first side of the integrated circuit such that a plane of the one or more sensor elements is locally normal to a sensor stack normal, wherein the interposer is configured to operationally couple the second side of the sensor elements in the sensor array to the first side of the integrated circuit. In addition, the method includes operationally coupling the first plurality of contact pads on the first side of the integrated circuit to a second plurality of contact pads on the second side of the sensor array to form a tileable sensor stack.
摘要:
An interface assembly for a sensor array is provided. The interface assembly may be made up of an integrated circuit package thermally coupled to the sensor array. The interface assembly may include a temperature control system for controlling the temperature of the sensor array. The temperature control system includes a temperature sensor for sensing a temperature variation of each sensor of the sensor array from an initial temperature beyond a predetermined threshold. A temperature controller is coupled to each temperature sensor and receives an output signal from the temperature sensor upon the sensor temperature variation exceeding the predetermined threshold. A temperature correction device is coupled to each temperature controller and causes the sensor temperature variation to fall within the predetermined threshold upon receiving a control signal from the temperature controller.
摘要:
An interface assembly for a sensor array is provided. The interface assembly may be made up of an integrated circuit package thermally coupled to the sensor array. The interface assembly may include a temperature control system for controlling the temperature of the sensor array. The temperature control system includes a temperature sensor for sensing a temperature variation of each sensor of the sensor array from an initial temperature beyond a predetermined threshold. A temperature controller is coupled to each temperature sensor and receives an output signal from the temperature sensor upon the sensor temperature variation exceeding the predetermined threshold. A temperature correction device is coupled to each temperature controller and causes the sensor temperature variation to fall within the predetermined threshold upon receiving a control signal from the temperature controller.
摘要:
Various configurations for scatter reduction and control are provided for CT imaging. These configurations include an imaging system having a stationary detector extending generally around a portion of an imaging volume and a distributed X-ray source placed proximal to the stationary detector for radiating an X-ray beam toward the stationary detector. A scatter control system is further provided that is configured to adaptively operate in cooperation with the stationary detector and the distributed X-ray source to focally align collimator septa contained therein to the X-ray beam at a given focal point and to provide X-ray beam scatter control.
摘要:
A detector assembly is presented. The detector assembly includes a first detector layer having a top side and a bottom side, where the first detector layer includes a plurality of first coupling gaps. Additionally, the detector assembly includes a first interconnect structure operationally coupled to the first detector layer and configured to facilitate transfer of a first set of image data from the first detector layer to backplane electronics. The detector assembly also includes a second detector layer having a top side and a bottom side and disposed adjacent the bottom side of the first detector layer, where the second detector layer includes a plurality of second coupling gaps configured to facilitate passage of the first interconnect structure from the first detector layer to the backplane electronics. Also, the detector assembly includes a second interconnect structure operationally coupled to the second detector layer and configured to facilitate transfer of a second set of image data from the second detector layer to the backplane electronics.
摘要:
An energy-sensitive computed tomography system is provided. The energy-sensitive computed tomography system includes an X-ray source configured to emit an X-ray beam resulting from electrons impinging upon a target material. The energy-sensitive computed tomography system also includes an object positioned within the X-ray beam. The energy-sensitive computed tomography system further includes a detector configured to receive a transmitted beam of the X-rays through the object. The energy-sensitive computed tomography system also includes a filter having an alternating pattern disposed between the X-ray source and the detector, the filter configured to facilitate measuring projection data that can be used to generate low-energy and high-energy spectral information.