发明授权
- 专利标题： IC tag-bearing wiring board and method of fabricating the same
- 专利标题（中）： IC标签承载线路板及其制造方法
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申请号： US11061149申请日： 2005-02-18
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公开(公告)号： US07586446B2公开(公告)日： 2009-09-08
- 发明人: Isao Sakama , Minoru Ashizawa
- 申请人： Isao Sakama , Minoru Ashizawa
- 申请人地址： JP
- 专利权人： Hitachi, Ltd.
- 当前专利权人： Hitachi, Ltd.
- 当前专利权人地址： JP
- 代理机构： Townsend and Townsend and Crew LLP
- 优先权： JP2004-193719 20040630
- 主分类号： H01Q1/24
- IPC分类号： H01Q1/24
摘要：
To improve electronic part packaging efficiency without sacrificing the transmission distance of a radio IC tag, a recess is formed in the front side surface of a printed wiring board. An IC chip is placed in the recess so that the IC chip does not protrude from the front side surface, a first major surface 1a and a second major surface of the printed wiring board. Antenna elements of an antenna are formed on the front side surface on the opposite sides, respectively, of the IC chip, and the antenna is connected to the IC chip. The antenna is a dipole antenna of a length equal to half the wavelength of radio waves to be radiated by the antenna.
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