发明授权
US07586747B2 Scalable subsystem architecture having integrated cooling channels
失效
具有集成冷却通道的可扩展子系统架构
- 专利标题： Scalable subsystem architecture having integrated cooling channels
- 专利标题（中）： 具有集成冷却通道的可扩展子系统架构
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申请号： US11495954申请日： 2006-07-27
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公开(公告)号： US07586747B2公开(公告)日： 2009-09-08
- 发明人: Peter C. Salmon
- 申请人： Peter C. Salmon
- 申请人地址： US CA Mountain View
- 专利权人： Salmon Technologies, LLC.
- 当前专利权人： Salmon Technologies, LLC.
- 当前专利权人地址： US CA Mountain View
- 代理机构： Dorsey & Whitney LLP
- 主分类号： H05K7/20
- IPC分类号： H05K7/20
摘要：
A method for building scalable electronic subsystems is described. Stackable modules employ copper substrates with solder connections between modules, and a ball grid array interface is provided at the bottom of the stack. A cooling channel is optionally provided between each pair of modules. Each module is re-workable because all integrated circuit attachments within the module employ re-workable flip chip connectors. Also, defective modules can be removed from the stack by directing hot inert gas at externally accessible solder connections.
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