Invention Grant
- Patent Title: Method for fabricating lateral semiconductor device
- Patent Title (中): 横向半导体器件的制造方法
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Application No.: US11632934Application Date: 2005-08-02
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Publication No.: US07589347B2Publication Date: 2009-09-15
- Inventor: Geoffrey Richard Nash , John Henry Jefferson , Keith James Nash
- Applicant: Geoffrey Richard Nash , John Henry Jefferson , Keith James Nash
- Applicant Address: GB
- Assignee: Qinetiq Limited
- Current Assignee: Qinetiq Limited
- Current Assignee Address: GB
- Agency: McDonnell Boehnen Hulbert & Berghoff LLP
- Priority: GB0417738.2 20040809
- International Application: PCT/GB2005/003021 WO 20050802
- International Announcement: WO2006/016118 WO 20060216
- Main IPC: H01L31/00
- IPC: H01L31/00

Abstract:
A lateral junction semiconductor device and method for fabricating the same comprising the steps of taking a semiconductor structure having a stack formed by a plurality of layers of semiconductor material arranged in a series of substantially parallel planes, the semiconductor material within a first layer having an excess of charge carriers of a first polarity at a first concentration, and selectively removing semiconductor material from the first layer to a depth which varies along a first direction substantially parallel with the planes of the layers within the structure, so as to provide a gradation of the concentration of charge carriers of first polarity within an active layer along the first direction. A photon source comprising said lateral junction semiconductor device.
Public/Granted literature
- US20080087876A1 Method for Fabricating Lateral Semiconductor Device Public/Granted day:2008-04-17
Information query
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