Invention Grant
- Patent Title: Thin glass chip for an electronic component and manufacturing method
- Patent Title (中): 电子元件薄玻璃芯片及其制造方法
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Application No.: US11213098Application Date: 2005-08-26
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Publication No.: US07591958B2Publication Date: 2009-09-22
- Inventor: Pascal Gardes , Fabrice Guitton
- Applicant: Pascal Gardes , Fabrice Guitton
- Applicant Address: FR Montrouge
- Assignee: STMicroelectronics SA
- Current Assignee: STMicroelectronics SA
- Current Assignee Address: FR Montrouge
- Agency: Graybeal Jackson LLP
- Agent Lisa K. Jorgensen; Paul F. Rusyn
- Priority: FR0452039 20040914
- Main IPC: B44C1/22
- IPC: B44C1/22
Abstract:
The manufacturing of electronic components on individual substrates made of an insulating material includes molding, in a silicon wafer, an insulating material with a thickness corresponding to the final thickness desired for the substrates, manufacturing the electronic components, and removing the silicon from the rear surface of the wafer after manufacturing of the components.
Public/Granted literature
- US20060057782A1 Thin glass chip for an electronic component and manufacturing method Public/Granted day:2006-03-16
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