公开(公告)号：US20060057782A1

公开(公告)日：2006-03-16

申请号：US11213098

申请日：2005-08-26

Applicant: Pascal Gardes ,  Fabrice Guitton

Inventor： Pascal Gardes ,  Fabrice Guitton

IPC: H01L21/50 ,  H01L21/48 ,  H01L21/44

CPC classification number: H01L21/6836 ,  H01L21/6835 ,  H01L21/78 ,  H01L24/97 ,  H01L2221/68327 ,  H01L2221/68354 ,  H01L2221/68363 ,  H01L2221/68377 ,  H01L2224/16 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2224/0401

Abstract: The manufacturing of electronic components on individual substrates made of an insulating material includes molding, in a silicon wafer, an insulating material with a thickness corresponding to the final thickness desired for the substrates, manufacturing the electronic components, and removing the silicon from the rear surface of the wafer after manufacturing of the components.

公开(公告)号：US07591958B2

公开(公告)日：2009-09-22

申请号：US11213098

申请日：2005-08-26

Applicant: Pascal Gardes ,  Fabrice Guitton

Inventor： Pascal Gardes ,  Fabrice Guitton

IPC: B44C1/22

CPC classification number: H01L21/6836 ,  H01L21/6835 ,  H01L21/78 ,  H01L24/97 ,  H01L2221/68327 ,  H01L2221/68354 ,  H01L2221/68363 ,  H01L2221/68377 ,  H01L2224/16 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2224/0401

Abstract: The manufacturing of electronic components on individual substrates made of an insulating material includes molding, in a silicon wafer, an insulating material with a thickness corresponding to the final thickness desired for the substrates, manufacturing the electronic components, and removing the silicon from the rear surface of the wafer after manufacturing of the components.

Abstract translation: 在由绝缘材料制成的单个基板上的电子部件的制造包括在硅晶片中模制具有对应于基板所需的最终厚度的厚度的绝缘材料，制造电子部件，以及从后表面去除硅 的晶片制造后的部件。

公开(公告)号：US20110266389A1

公开(公告)日：2011-11-03

申请号：US13078593

申请日：2011-04-01

Applicant: Stephane COMBES ,  Pascal Gardes

Inventor： Stephane COMBES ,  Pascal Gardes

IPC: B64D27/02 ,  B23P11/00

CPC classification number: B64D27/26 ,  B64D29/06 ,  F16B21/16

Abstract: The invention relates to a connection assembly of an engine pylori underneath an aircraft wing, the wing being provided with a fitting (6), the engine pylori being provided with a fork joint (5) nested in the fitting and fixed to the said fitting by means of a traversing pin system (10), provided with: an external primary pin (11), a secondary pin (12) mounted inside the primary pin, a primary shoulder (13) mounted directly around the primary pin, at a blind end of the pin system, to block the said pin in translation, a secondary shoulder (14) mounted around one end of the secondary pin, at a blind end of the pin system, to block the system in rotation, an interlocking assembly (15, 16) mounted around the primary pin and the secondary pin, at a free end of the pin system, to block the pin system in translation.

Abstract translation: 本发明涉及飞机机翼下方的发动机幽门螺杆的连接组件，翼部设置有配件（6），发动机幽门设置有嵌套在配件中的叉接头（5），并通过 具有：外部主销（11），安装在所述主销内部的辅助销（12）的横向销系统（10）的装置，在所述主销周边直接安装的主肩部（13） 所述销系统中的所述销平移，在所述销系统的盲端处安装在所述副销的一端周围的次级肩部（14），以阻止所述系统旋转;联锁组件（15， 16）安装在主销和辅助销周围，在销系统的自由端，以平移来阻止销系统。

公开(公告)号：US06830970B2

公开(公告)日：2004-12-14

申请号：US10268370

申请日：2002-10-10

Applicant: Pascal Gardes

Inventor： Pascal Gardes

IPC: H01L2900

CPC classification number: H01L28/10 ,  H01F17/0006 ,  H01F41/041 ,  H01L21/76898 ,  H01L23/481 ,  H01L23/5227 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A method for manufacturing, in a monolithic circuit including a substrate, an inductance and a through via, including the step of forming, from a first surface of the substrate, at least one trench according to the contour of the inductance to be formed; forming by laser in the substrate a through hole at the location desired for the via; simultaneously insulating the surface of the trench and of the hole; and depositing a conductive material in the trench and at least on the hole walls.

Abstract translation: 一种在包括基板，电感和通孔的单片电路中的制造方法，包括从基板的第一表面形成根据要形成的电感的轮廓的至少一个沟槽的步骤; 在基板上通过激光在通孔所需的位置形成通孔; 同时绝缘沟槽和孔的表面; 以及在沟槽和至少在孔壁上沉积导电材料。

公开(公告)号：US20110114786A1

公开(公告)日：2011-05-19

申请号：US12674555

申请日：2008-08-22

Applicant: Emmanuel Guillet ,  Jean-Marc Martinou ,  Pascal Gardes

Inventor： Emmanuel Guillet ,  Jean-Marc Martinou ,  Pascal Gardes

IPC: B64D27/02 ,  B64D27/26

CPC classification number: B64D27/26 ,  B64D2027/264 ,  B64D2027/268

Abstract: An aircraft engine attachment device including a rigid structure and a mechanism attaching the engine on the rigid structure, the attachment mechanism including a rear engine attachment and a device for taking-up thrust forces generated by the engine. The rear engine attachment is attached to the rigid structure by two lateral fittings attached to the rigid structure. The force take-up device includes two connecting rods mechanically connected to a spreader beam by a mechanical connection, a connection fitting attached to the rear engine attachment and mechanically connected to the rigid structure by a thrust pin, the lateral fittings including a stop mechanism to limit pivoting of the spreader beam if a connecting rod breaks and ensuring transmission of thrust forces to the rigid structure.

Abstract translation: 一种飞机发动机附接装置，包括刚性结构和将发动机附接在刚性结构上的机构，所述附接机构包括后部发动机附件和用于吸收由发动机产生的推力的装置。 后部发动机附件通过附接到刚性结构的两个侧向配件附接到刚性结构。 力吸收装置包括通过机械连接机械地连接到吊架梁的两个连杆，连接到后发动机附件的连接配件并通过推力销机械地连接到刚性结构件，该横向配件包括止动机构 如果连杆断裂并确保将推力传递到刚性结构，则吊具梁的极限枢转。

公开(公告)号：US20080156930A1

公开(公告)日：2008-07-03

申请号：US11913950

申请日：2006-06-27

Applicant: Virginie Audart-Noel ,  Pascal Gardes

Inventor： Virginie Audart-Noel ,  Pascal Gardes

IPC: F02C7/20 ,  B64D27/00

CPC classification number: B64D27/26 ,  F16C11/0614 ,  F16C11/0695 ,  F16C2326/43

Abstract: An aircraft engine attachment configured to be inserted between an engine and an EMS, the attachment including a clevis connected to a first fixing device including an end fitting with two arms and a pin passing through the clevis and the two arms, in each of which an orifice is formed including a first ring and a second ring respectively holding the pin. The first ring includes a bottom acting as a stop for a first end of the pin, and the first attachment device includes a mechanism to stop the pin in translation cooperating with a second end of the pin.

Abstract translation: 一种构造成插入在发动机和EMS之间的飞机发动机附件，该附件包括连接到第一固定装置的U形夹，该第一固定装置包括具有两个臂的端部配件和穿过该U形夹和两个臂的销， 孔形成包括分别保持销的第一环和第二环。 所述第一环包括用作所述销的第一端的止动件的底部，并且所述第一附接装置包括用于使所述销的平移与所述销的第二端协作的机构。

公开(公告)号：US08740136B2

公开(公告)日：2014-06-03

申请号：US11913950

申请日：2006-06-27

Applicant: Virginie Audart-Noel ,  Pascal Gardes

Inventor： Virginie Audart-Noel ,  Pascal Gardes

IPC: B64D27/00

CPC classification number: B64D27/26 ,  F16C11/0614 ,  F16C11/0695 ,  F16C2326/43

Abstract: An aircraft engine attachment configured to be inserted between an engine and an EMS, the attachment including a plate assembly connected to a first fixing device including an end fitting with two arms and a pin passing through the plate assembly and the two arms, in each of which an orifice is formed including a first ring and a second ring respectively holding the pin. The first ring includes a bottom acting as a stop for a first end of the pin, and the first attachment device includes a mechanism to stop the pin in translation cooperating with a second end of the pin.

Abstract translation: 一种构造成插入在发动机和EMS之间的飞机发动机附件，所述附件包括连接到第一固定装置的板组件，所述第一固定装置包括具有两个臂的端部配件以及穿过所述板组件和所述两个臂的销 其形成有孔，其包括分别保持销的第一环和第二环。 所述第一环包括用作所述销的第一端的止动件的底部，并且所述第一附接装置包括用于使所述销的平移与所述销的第二端协作的机构。

公开(公告)号：US20100090056A1

公开(公告)日：2010-04-15

申请号：US12596784

申请日：2008-04-22

Applicant: Pascal Gardes ,  Stephane Combes

Inventor： Pascal Gardes ,  Stephane Combes

IPC: B64D27/12 ,  B64C1/06

CPC classification number: B64D27/26 ,  B64D2027/264 ,  B64D2027/266

Abstract: An aircraft assembly including a wing element and an attachment pylori of a turboengine, including a rigid structure forming a caisson defined externally by a first longeron, a second longeron, and two lateral panels. The assembly also includes an attachment mechanism of the structure on the wing element, fitted with two front attachments, each including two first fittings solid with the associated lateral panel. For each front attachment, the two first fittings are arranged respectively on either side of their associated lateral panel.

Abstract translation: 包括翼元件和涡轮发动机的附接幽门的飞行器组件，包括形成由第一长龙，第二长龙和两个侧面板外部定义的沉箱的刚性结构。 组件还包括在翼元件上的结构的附接机构，其具有两个前附件，每个包括两个与相关联的侧板实体固定的第一配件。 对于每个前附件，两个第一配件分别布置在其相关侧板的两侧。

公开(公告)号：US08561941B2

公开(公告)日：2013-10-22

申请号：US13078593

申请日：2011-04-01

Applicant: Stephane Combes ,  Pascal Gardes

Inventor： Stephane Combes ,  Pascal Gardes

IPC: B64D27/00

CPC classification number: B64D27/26 ,  B64D29/06 ,  F16B21/16

Abstract: A connection assembly of an engine pylon underneath an aircraft wing, the wing being provided with a fitting, the engine pylon being provided with a fork joint nested in the fitting and fixed to the said fitting by means of a traversing pin system, including: an external primary pin, a secondary pin mounted inside the primary pin, a primary shoulder mounted directly around the primary pin, at a blind end of the pin system, to block the said pin in translation, a secondary shoulder mounted around one end of the secondary pin, at a blind end of the pin system, to block the system in rotation, and an interlocking assembly mounted around the primary pin and the secondary pin, at a free end of the pin system, to block the pin system in translation.

Abstract translation: 一种在飞行器机翼下方的发动机塔架的连接组件，所述机翼设置有配件，所述发动机吊架设置有嵌套在所述配件中的叉形接头，并通过横动销系统固定到所述配件，包括： 外部主销，安装在所述主销内的辅助销，在所述销系统的盲端处直接安装在所述主销周围的主肩部，以平滑地阻挡所述销，安装在所述二次侧的一端的副肩 引脚在引脚系统的盲端处阻止系统旋转，并且在引脚系统的自由端处安装在主引脚和次级引脚周围的互锁组件以平移来阻止引脚系统。

公开(公告)号：US06884726B2

公开(公告)日：2005-04-26

申请号：US10217577

申请日：2002-08-13

Applicant: Pascal Gardes

Inventor： Pascal Gardes

IPC: H01L21/68 ,  H01L21/302

CPC classification number: H01L21/6835 ,  H01L2221/68318

Abstract: A method for handling a thin silicon wafer including the steps of successively forming on a surface of the wafer a first protection layer, a first etch stop layer, and an external layer; forming on a surface of a support wafer a gluing layer of the same material as the external layer of the wafer, the surface of the support wafer including a plurality of pads, the respective upper portions of which are substantially planar and coplanar; fastening, by direct gluing, the external layer of the wafer and the gluing layer of the support wafer; processing the wafer to form circuits therein; depositing a second protection layer on the wafer surface which is not glued to the support wafer; and removing by an etch process the material forming the external layer of the wafer and the gluing layer of the support wafer.

Abstract translation: 一种处理薄硅晶片的方法，包括以下步骤：在晶片的表面上依次形成第一保护层，第一蚀刻停止层和外层; 在支撑晶片的表面上形成与晶片的外部层相同材料的胶合层，支撑晶片的表面包括多个焊盘，其相应的上部基本上是平面的并且是共面的; 通过直接胶合紧固晶片的外层和支撑晶片的胶合层; 处理晶片以在其中形成电路; 在晶片表面上沉积第二保护层，所述第二保护层未胶合到所述支撑晶片; 以及通过蚀刻工艺去除形成晶片的外部层和支撑晶片的胶合层的材料。