发明授权
- 专利标题： Wired circuit board assembly sheet
- 专利标题（中）： 有线电路板组装板
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申请号： US11783999申请日： 2007-04-13
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公开(公告)号： US07592551B2公开(公告)日： 2009-09-22
- 发明人: Toshiki Naito , Tetsuya Ohsawa , Kouji Kataoka
- 申请人： Toshiki Naito , Tetsuya Ohsawa , Kouji Kataoka
- 申请人地址： JP Osaka
- 专利权人： Nitto Denko Corporation
- 当前专利权人： Nitto Denko Corporation
- 当前专利权人地址： JP Osaka
- 代理机构： Akerman Senterfitt
- 代理商 Jean C. Edwards, Esq.
- 优先权： JP2006-111163 20060413
- 主分类号： H05K1/00
- IPC分类号： H05K1/00
摘要：
A wired circuit board assembly sheet having a plurality of wired circuit boards, distinguishing marks for distinguishing defectiveness of the wired circuit boards, and a supporting sheet for supporting the plurality of wired circuit boards and the distinguishing marks. Each of the distinguishing marks has an indication portion for indicating a specified wired circuit board.
公开/授权文献
- US20070241764A1 Wired circuit board assembly sheet 公开/授权日：2007-10-18
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