发明授权
- 专利标题: Fabricating method for a metal oxide semiconductor transistor
- 专利标题(中): 金属氧化物半导体晶体管的制造方法
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申请号: US11532100申请日: 2006-09-15
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公开(公告)号: US07595234B2公开(公告)日: 2009-09-29
- 发明人: Po-Chao Tsao , Chang-Chi Huang , Ming-Tsung Chen , Yi-Yiing Chiang , Yu-Lan Chang , Chung-Ju Lee , Chih-Ning Wu , Kuan-Yang Liao
- 申请人: Po-Chao Tsao , Chang-Chi Huang , Ming-Tsung Chen , Yi-Yiing Chiang , Yu-Lan Chang , Chung-Ju Lee , Chih-Ning Wu , Kuan-Yang Liao
- 申请人地址: TW Hsinchu
- 专利权人: United Microelectronics Corp.
- 当前专利权人: United Microelectronics Corp.
- 当前专利权人地址: TW Hsinchu
- 代理商 Chun-Ming Shih
- 主分类号: H01L21/336
- IPC分类号: H01L21/336
摘要:
A method for forming a metal oxide semiconductor (MOS) transistor is provided. First, a gate structure is formed over a substrate. Then, offset spacers are formed on respective sidewalls of the gate structure. A first ion implantation process is performed to form a lightly doped drain (LDD) in the substrate beside the gate structure. Other spacers are formed on respective sidewalls of the offset spacers. Thereafter, a second ion implantation process is performed to form source/drain region in the substrate beside the spacers. Then, a metal silicide layer is formed on the surface of the source and the drain. An oxide layer is formed on the surface of the metal silicide layer. The spacers are removed and an etching stop layer is formed on the substrate. With the oxide layer over the metal silicide layer, the solvent for removing the spacers is prevented from damaging the metal silicide layer.
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