发明授权
US07598605B2 Semiconductor device having capacitive insulation means and communication terminal using the device
有权
具有电容绝缘装置的半导体装置和使用该装置的通信终端
- 专利标题： Semiconductor device having capacitive insulation means and communication terminal using the device
- 专利标题（中）： 具有电容绝缘装置的半导体装置和使用该装置的通信终端
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申请号： US11495585申请日： 2006-07-31
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公开(公告)号： US07598605B2公开(公告)日： 2009-10-06
- 发明人: Noboru Akiyama , Minehiro Nemoto , Seigou Yukutake , Yasuyuki Kojima , Kazuyuki Kamegaki
- 申请人： Noboru Akiyama , Minehiro Nemoto , Seigou Yukutake , Yasuyuki Kojima , Kazuyuki Kamegaki
- 申请人地址： JP Tokyo
- 专利权人： Hitachi, Ltd.
- 当前专利权人： Hitachi, Ltd.
- 当前专利权人地址： JP Tokyo
- 代理机构： Antonelli, Terry, Stout & Kraus, LLP.
- 优先权： JP2001-064319 20010308
- 主分类号： H01L23/24
- IPC分类号： H01L23/24 ; H01L23/02 ; H01L23/28 ; H05K7/02
摘要：
A primary side circuit and a secondary side circuit are provided on first and second semiconductor substrates, respectively. A first capacitive insulator on the first substrate electrically insulates and isolates between the primary and secondary side circuits while permitting signal transmission between these circuits. A second capacitive insulator on the second semiconductor substrate electrically isolates the primary and secondary side circuit while permitting signal transmission therebetween. First and second frames are provided for input and output of signals to and from the primary and secondary side circuits. External electrodes of the first and second capacitive insulators are connected together by a third lead frame via a conductive adhesive body including more than one solder ball. The first and second substrates and the lead frames are sealed by a dielectric resin.
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